Deposition Microfabrication Tools
About
Deposition equipment and processes can produce thin films of up to several microns of metal and oxide. Depending on the tool and the process, the layers have different characteristics: isotropic, compliance, electrical performance, electrical insulation, doped films, ....
Description
Multi-target Metallization PVD Cr|Cu|W|Ta|TiN|TiO2|Ti|Au|Nb (Plassys) : Compatible with samples up to 100mm
Multi-target Oxide&Metallization PVD Ti|Al|Ta|Nb|TiN|AlN|NbN|SiOx|SiNx|ITO|NiFe (Alliance Concept) : Compatible with samples up to 100mm
Electron Beam Evaporation Ti|Cr|Al|Au|Cu|Ag|Co|Sn|NiCr|NiFe|CoFe|Co|T (Plassys) – Cryo Deposition : Compatible with samples up to 100mm
Electron Beam Evaporation Ti|Cr|Au|Al|Ni|Pt|Ge|Pd|Nb|V (Plassys) : Compatible with samples up to 100mm
ICPCVD SiN|SiO2|a-Si (Sentech) : Compatible with samples up to 200mm
Atomic Layer Deposition Al2O3|TiO2|HfO2|ZrO2|ZnO|AZO (Cambridge Nanotech) : Compatible with samples up to 200mm
Atomic Layer Deposition Al2O3|TiO2|HfO2|TiN|ZnO|AZO (Oxford) : Compatible with samples up to 200mm
LPCVD Poly-Si (Tempress) : Compatible with samples up to 100mm
PECVD SiOx|SiNx|a-Si (Corial) : Compatible with samples up to 200mm
Keywords : PVD, EBD, LPCVD, PECVD, ICPCVD, ALD, RTA
Technical specifications:
Deposition equipment and processes enable the fabrication of thin films ranging from a few nanometers to several microns in thickness, covering both metal and oxide materials. Supporting a wide range of sample sizes, from small substrates to 200mm wafers. Depositions can be performed individually or in batches, depending on the specific process and equipment used. The resulting films exhibit diverse properties—such as isotropy, mechanical compliance, electrical performance, insulation, and doping.
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