THINK - INFRACHIP

TECHNOLOGIES

Access novel components for energy-efficient computing paradigms based on novel logic switches and on beyond CMOS and von Neumann architectures. These include technology blocks for quantum and spin device engineering and components for brain-inspired/neuromorphic computing, thereby enabling to explore solution for intelligence-on-the-edge and accelerators for the future edge-computing.

THINK

Quantum and spin device engineering

The technology offering in this section will be offered by Chalmers, INL and Tyndall. The offering will have a full set of tools for processing of quantum and spin devices. The toolset include for example Electron beam lithography , direct write laser lithography , Dry etch , ALD of Al2O3, AlN, HfO2, SiO2, Ta2O5 (Oxford FlexAl), Metal evaporator Ti, Al, Cr, Au, Ge, Pd, Ni, Pt, Ag, Cu, V, Fe, Co, Al2O3 and Ta Aluminium evaporator and Ion beam etching On the characterisation side there will access to Ellipsometer, SEM, automated optical microscope, and various surface profilers and SPM.

The platform will also have facilities to fabricate spintronic devices, quantum devices like quantum dots, wells etc.

Components for neuromorphic computing

Under this technology pillar UNOVA, HMU, AMO and NCSRD will have their offereings. Installations are offered to advance neuromorphic computing research using oxide semiconductor-based technology on rigid or flexible substrates. There will be offerings on printed electronics, supported miniaturized circuits, portable energy devices and assembly of self-powered, flexible platforms for agriculture, smart wearables, IoT and industry 4.0 applications, neuromorphic computing using photonic reservoir computing chips, non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes etc.

Non volatile memories

NCSRD -INN will offer their non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes under this technology pillar.

Atomic Force Microscope

Showroom Tyndall Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Bruker Atomic Force Microscope (AFM) – Dimension Icon...

Access Provider / Facilities

Tyndall

Flexifab Nanofabrication Cleanroom

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Access to Tyndall FlexiFab Clean Room for non-standard processing...

Access Provider / Facilities

Tyndall

Planetary Ball Milliing PM100

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

The Planetary ball mill PM100 (Canada) is a compact, lubrication-free laboratory system designe...

Access Provider / Facilities

HMU

Oxide-based neuromorphic devices

Showroom UNINOVA Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Sense, Think

UNINOVA offers access to the entire value chain related to the design, simulation, fabrication,...

Access Provider / Facilities

UNINOVA

Printed thin films and devices

Showroom UNINOVA Devices / Test structures, Electrical, Mechanical, Metrology / Characterisation, Optical, Physical/Structural, Printing Component Neuromorphic computing, Green electronics and substrates, Green sensors, Sense, Stretchable and flexible sensors, Sustain, Think

UNINOVA offers the access to the entire value chain related to the production and characterizat...

Access Provider / Facilities

UNINOVA

Spray system

Showroom HMU Devices / Test structures, Metal deposition, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Custom made Spray (pyrolysis) System, with multiple nozzles. Suitable for metal oxide depositio...

Access Provider / Facilities

HMU

Milling and size separation

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Powders processing by milling and dimensional separation....

Access Provider / Facilities

HMU

Plasma – enhanced Chemical Vapor Deposition (PECVD)

Showroom HMU Plasma etching, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

The above-mentioned technique is crucial for fabricating and characterizing materials like grap...

Access Provider / Facilities

HMU

Hot roll mill

Showroom HMU Devices / Test structures, Dielectric deposition, Metal deposition, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Mixing hot roll milling machine - it can produce thermoplastic materials master batches up to 0...

Access Provider / Facilities

HMU

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822