TECHNOLOGIES

Access novel components for energy-efficient computing paradigms based on novel logic switches and on beyond CMOS and von Neumann architectures. These include technology blocks for quantum and spin device engineering and components for brain-inspired/neuromorphic computing, thereby enabling to explore solution for intelligence-on-the-edge and accelerators for the future edge-computing.

THINK

Quantum and spin device engineering

The technology offering in this section will be offered by Chalmers, INL and Tyndall. The offering will have a full set of tools for processing of quantum and spin devices. The toolset include for example Electron beam lithography , direct write laser lithography , Dry etch , ALD of Al2O3, AlN, HfO2, SiO2, Ta2O5 (Oxford FlexAl), Metal evaporator Ti, Al, Cr, Au, Ge, Pd, Ni, Pt, Ag, Cu, V, Fe, Co, Al2O3 and Ta Aluminium evaporator and Ion beam etching On the characterisation side there will access to Ellipsometer, SEM, automated optical microscope, and various surface profilers and SPM.

The platform will also have facilities to fabricate spintronic devices, quantum devices like quantum dots, wells etc.

Components for neuromorphic computing

Under this technology pillar UNOVA, HMU, AMO and NCSRD will have their offereings. Installations are offered to advance neuromorphic computing research using oxide semiconductor-based technology on rigid or flexible substrates. There will be offerings on printed electronics, supported miniaturized circuits, portable energy devices and assembly of self-powered, flexible platforms for agriculture, smart wearables, IoT and industry 4.0 applications, neuromorphic computing using photonic reservoir computing chips, non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes etc.

Non volatile memories

NCSRD -INN will offer their non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes under this technology pillar.

Formlabs 3B+

, , , , , , , , , , , , , , , , , ,
Parts manufactured with the vat photopolymerization 3D printing method from various polymeric rParts manufactured with the vat photopolymerization 3D printing method from various polymeric r...
Access Provider / Facilities
HMU

EnvisionTec developer bioplotter

, , , , , , , , , , , , , ,
3D bioplotter capable for the manufacturing of biocompatible materials with the bioplotting 3D 3D bioplotter capable for the manufacturing of biocompatible materials with the bioplotting 3D ...
Access Provider / Facilities
HMU

Ecopia HMS-3000

, , , ,
Van Der Pauw Method For Resistivity & Hall MobilityVan Der Pauw Method For Resistivity & Hall Mobility...
Access Provider / Facilities
HMU

Cyclic voltammetry and electrochemical impedance spectroscopy, Measurement of full battery cell

, , , , , , ,
Cyclic voltammetry and electrochemical impedance spectroscopy (EIS) are vital techniques used iCyclic voltammetry and electrochemical impedance spectroscopy (EIS) are vital techniques used i...
Access Provider / Facilities
HMU

Ball Milling XH-401C

, , , , , , ,
Hot roll milling machine (XH-401C) for producing thermoplastic master batches up to 0.5 kg.Hot roll milling machine (XH-401C) for producing thermoplastic master batches up to 0.5 kg....
Access Provider / Facilities
HMU

Arkeo platform

, , , , ,
The Arkeo platform by Cicci Research offers a comprehensive range of measurement capabilities fThe Arkeo platform by Cicci Research offers a comprehensive range of measurement capabilities f...
Access Provider / Facilities
HMU

Ambient Pressure Photoemission Spectroscopy System APS04

, , , , , , ,
The APS04 system combines APS and high-resolution KP for fast semiconductor property analysis, The APS04 system combines APS and high-resolution KP for fast semiconductor property analysis, ...
Access Provider / Facilities
HMU

3Dgence F420

, , , , , , , , , , , , ,
Industrial specifications 3D printer capable for the manufacturing of the biocompatible PEEK poIndustrial specifications 3D printer capable for the manufacturing of the biocompatible PEEK po...
Access Provider / Facilities
HMU

3devo composer 450

, , , , , , , , , , , ,
Filament composer compatible with the material extrusion 3D printing method from various polymeFilament composer compatible with the material extrusion 3D printing method from various polyme...
Access Provider / Facilities
HMU