CONNECT - INFRACHIP

TECHNOLOGIES

Access what you need to build energy-efficient radio and optical communications for autonomous hybrid systems for the secure edge. The technology blocks on offer range from characterisation installations to complete set of process tools and libraries for the fabrication of microwave and photonic devices to novel platform technologies based on materials such as graphene and polymers.

CONNECT

RF Components

This technology pillar will have offerings from Chalmers, AMO, Tyndall and CNRS. The offering will include the microwave and photonic processing line consisting of a complete set of process tools for the fabrication of microwave and photonic devices and components. It will have on offer MMIC process which can be used to realize graphene-based circuits for RF communications, for example at WiFi frequency. AlN and AlScN semicondutor wafer processing for RF front applications will be available on this technology Platform. Energy harvesting in the field of electromagnetic energy harvesting, mixed signal design, characterization of RF components, antennas and innovative substrates will be on offer.

RF Front end design

AMO and Tyndall will provide their capabilties under this technology pillar. The offerings will have the MMIC process which can be used to realize graphene-based circuits for RF communications, for example at WiFi frequency. The offering will also have the Surface Acoustic Wave resonator development platform for RF front end application.

Short range optical communications

JOR will offer their optical communications technology under this section. They have set up a platform to offer (Freeform) Micro-optical components, Photonic structures (e.g. Plasmonic, metalenses) , Waveguides, resonators and Optical design.

Atomic Force Microscope

Showroom Tyndall Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Bruker Atomic Force Microscope (AFM) – Dimension Icon...

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Tyndall

Flexifab Nanofabrication Cleanroom

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Access to Tyndall FlexiFab Clean Room for non-standard processing...

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Tyndall

HyperPath

Showroom Tyndall Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Connect, RF components, RF front-end design, Short-range optical communications

HyperPath is a software solution for enabling secure and reliable wireless connectivity for cha...

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Tyndall

400 GHz Vector Network Analyser (VNA) and antenna chamber

Showroom Tyndall Devices / Test structures Connect, RF components, RF front-end design, Short-range optical communications

Vector Network Analyser capable of performing measurements up to 400 GHz. The VNA is natively c...

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Tyndall

Electronic Component Packaging

Showroom Tyndall Advanced sensing, Connect, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, Sense, Stretchable and flexible sensors, Sustain

The Tyndall Packaging Laboratory offers a comprehensive range of component assembly capabilitie...

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Tyndall

Equipment offering: Piezoelectric coefficient d33 measurement

Showroom Tyndall Dielectric deposition, Electrical, Metal deposition, Metrology / Characterisation, Processing/Fabrication Advanced sensing, Connect, Energy autonomy, Power, RF components, RF front-end design, Sense

d33 indicates charge per unit force in the polarisation direction a piezoelectric sample. In Ty...

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Tyndall

Piezoelectric Al1-xScxN thin-film stack

Showroom Tyndall Dielectric deposition, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

Tyndall National Institute offers Piezoelectric Al1-xScxN thin-film with Sc concentration of 6%...

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Tyndall

Advanced PiezoMEMS device design and fabrication

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...

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Tyndall

Transfer printing for heterogeneous integration

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Suitably prepared photonic or electronic components can be heterogeneously integrated by transf...

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Tyndall

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822