SUSTAIN - INFRACHIP

TECHNOLOGIES

Here are listed all the required processing steps and technologies for developing sustainable low-power electronics with low manufacturing cost and low environmental impact during manufacturing.

SUSTAIN

Green Electronics & Substrates

UNOVA, HMU and JOR will have their technology offerings under this platform. This technology pillar offers users economically and environmentally sustainable routes to prepare substrates, inks, films and devices, that can be used as standalone projects or as components for the integration of systems. The platform also offers characterization facilities. The offering will be on semiconductor and flexible substrates.

Green Sensors

Tyndall and WUT/ CEZAMAT will have their offerings under this platform. Under this platform there will be offerings to develop LIG sensors both of flexible and wafer substrates. It will have on offering development of electronic structures such as luminescent displays, textronic materials and graphene electrodes on flexible and stretchable substrates such as polymer film, common fabrics and paper.

Hybrid SiP/SoC

WUT/CEZAMT and Tyndall will offer their Hybrid and heterogeneous integration capabilities under this technology pillar. The offering will have the capability to perform the assembly using a Finetech Flip-Chip Pico device or a small, self-built heating press, allowing for multiple connections to be made at the same time. The platform will offer the Micro Transfer Printing technology for packaging.

Photolithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive ma...

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NCSR Demokritos

Rapid Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Rapid Thermal Processing (RTP) is a heat treatment where semiconductor substrates or other mate...

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NCSR Demokritos

Metal Evaporators

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Metal evaporation is a versatile high-vacuum physical vapour deposition technique for producing...

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NCSR Demokritos

Ion Implanter

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Implantation of atoms or molecules into a solid to modify its physicochemical properties. This ...

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NCSR Demokritos

Furnace Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Thermal treatments at atmospheric pressure in hot-walled quartz tube furnaces under oxidizing o...

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NCSR Demokritos

Electron Beam Lithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Short-range optical communications, Sustain, Think

Electron beam lithography (EBL) is a versatile mask-less (“direct-write”) patterning techni...

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NCSR Demokritos

Dry (Plasma) Etching

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Dry Etching of dielectric, semiconductor and metal layers using Reactive Ion Etching (RIE) and ...

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NCSR Demokritos

LPCVD

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Low-Pressure Chemical Vapor Deposition (LPCVD) is a thermal process used to produce thin films ...

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NCSR Demokritos

Direct laser writing (DLW) facilities

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Direct laser writing is a fabrication technique that uses a focused laser beam to create precis...

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Tyndall

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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