TECHNOLOGIES

Here are listed all the required processing steps and technologies for developing sustainable low-power electronics with low manufacturing cost and low environmental impact during manufacturing.

SUSTAIN

Green Electronics & Substrates

UNOVA, HMU and JOR will have their technology offerings under this platform. This technology pillar offers users economically and environmentally sustainable routes to prepare substrates, inks, films and devices, that can be used as standalone projects or as components for the integration of systems. The platform also offers characterization facilities. The offering will be on semiconductor and flexible substrates.

Green Sensors

Tyndall and WUT/ CEZAMAT will have their offerings under this platform. Under this platform there will be offerings to develop LIG sensors both of flexible and wafer substrates. It will have on offering development of electronic structures such as luminescent displays, textronic materials and graphene electrodes on flexible and stretchable substrates such as polymer film, common fabrics and paper.

Hybrid SiP/SoC

WUT/CEZAMT and Tyndall will offer their Hybrid and heterogeneous integration capabilities under this technology pillar. The offering will have the capability to perform the assembly using a Finetech Flip-Chip Pico device or a small, self-built heating press, allowing for multiple connections to be made at the same time. The platform will offer the Micro Transfer Printing technology for packaging.

Formlabs 3B+

, , , , , , , , , , , , , , , , , ,
Parts manufactured with the vat photopolymerization 3D printing method from various polymeric rParts manufactured with the vat photopolymerization 3D printing method from various polymeric r...
Access Provider / Facilities
HMU

EnvisionTec developer bioplotter

, , , , , , , , , , , , , ,
3D bioplotter capable for the manufacturing of biocompatible materials with the bioplotting 3D 3D bioplotter capable for the manufacturing of biocompatible materials with the bioplotting 3D ...
Access Provider / Facilities
HMU

Cyclic voltammetry and electrochemical impedance spectroscopy, Measurement of full battery cell

, , , , , , ,
Cyclic voltammetry and electrochemical impedance spectroscopy (EIS) are vital techniques used iCyclic voltammetry and electrochemical impedance spectroscopy (EIS) are vital techniques used i...
Access Provider / Facilities
HMU

Ball Milling XH-401C

, , , , , , ,
Hot roll milling machine (XH-401C) for producing thermoplastic master batches up to 0.5 kg.Hot roll milling machine (XH-401C) for producing thermoplastic master batches up to 0.5 kg....
Access Provider / Facilities
HMU

Ambient Pressure Photoemission Spectroscopy System APS04

, , , , , , ,
The APS04 system combines APS and high-resolution KP for fast semiconductor property analysis, The APS04 system combines APS and high-resolution KP for fast semiconductor property analysis, ...
Access Provider / Facilities
HMU

3Dgence F420

, , , , , , , , , , , , ,
Industrial specifications 3D printer capable for the manufacturing of the biocompatible PEEK poIndustrial specifications 3D printer capable for the manufacturing of the biocompatible PEEK po...
Access Provider / Facilities
HMU

3devo composer 450

, , , , , , , , , , , ,
Filament composer compatible with the material extrusion 3D printing method from various polymeFilament composer compatible with the material extrusion 3D printing method from various polyme...
Access Provider / Facilities
HMU

PMU design (Power Management Unit)

, , , , , , , , , , , , , ,
Discrete and Silicon power management circuit for energy harvesting and micro-power management.Discrete and Silicon power management circuit for energy harvesting and micro-power management....
Access Provider / Facilities
Tyndall