Integrated training courses are built on the concept of Training Fab and comprise a combination of theoretical and hands-on practical parts.
INFRACHIP will offer Training Fab courses for both silicon processing and flexible electronics to students and professionals who want to learn more about device fabrication steps, equipment used for the processing and quality checks in place.
For Junior researchers and PhD, please also check the Research Accelerator Programme!
October-November 2024
2D Materials for Flexible Energy Harvesting and Storage Devices
HMU is preparing the first INFRACHIP School, divided into two parts:
– Self powered IoT applications enabled by 2D materials
– 2D materials based ink formulation and characterization
– 2D material enabled energy harvesters and storage units fabrication
– Device demonstrations characterization
“2D Materials for Flexible Energy Harvesting and Storage Devices” focuses on utilizing advanced 2D materials like graphene and dichalcogenides to develop innovative, flexible energy solutions. This includes processing these materials for additive manufacturing, creating printable and sprayable formulations, and optimizing their properties through functionalization and doping. The field also explores organic and perovskite solar cells, emphasizing improved performance and stability. Additionally, it involves the industrialization of printing processes for photovoltaic modules and the development of printed and flexible electronics for various applications, including smart wearables and IoT. These efforts aim to enhance device performance and create efficient, flexible energy harvesting and storage solutions.
The INFRACHIP school is open to Master and PhD students, research staff, engineers.
Applicants are responsible for their own travel and accommodation expenses. In case of EU applications, applicants should seek opportunities through EU mobility programs such as Erasmus. The same can be the case for international applications.
INFRACHIP plans to provide many other training opportunities, thanks to its consortium network. Summer or Winter school will be organised, as well as hybrid training.
More information about it will be added here.
TITLE: European Research Infrastructure on Semiconductor Chips
START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01
Coordinator: Tyndall National Institute
INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822