Direct laser writing (DLW) facilities
About
Direct laser writing is a fabrication technique that uses a focused laser beam to create precise three-dimensional graphitic micro- and nanostructures on various substrates from synthetic polymers and natural bioplastics. Engraving machines with different wavelengths, ranging from 405 nm to 450 nm and infrared (IR), are used for this process.
Description
Technical specifications:
Specifications of laser machines:
- CO2 laser machine (10.6 µm): Universal Laser PLS 4.75 System, 30 W (https://www.ulsinc.com/products/platforms/pls4-75).
- 405 nm laser engraver: Laser Pecker 1 Pro portable and handheld engraver, 3 W.
- 450 nm laser engraver: Laser Pecker LP2 portable and handheld laser engraver, 5 W. (https://www.laserpecker.net/products/laserpecker-2-basic-super-fast-handheld-laser-engraver-cutter?_pos=1&_fid=0ab9dfd8b&_ss=c&variant=40943702474799)
Case study:
The user aims to fabricate the transducing components of wearable biosensing devices on flexible polymeric or bioplastic substrates. By using our laser engraving machines, they can directly create sensing elements on the surface of these platforms. This technology is cost-effective, consumes low power, and is both reagent-free and scalable. They will be able to benefit from our expertise and available facilities to achieve their goal of fabricating biomarker tracking devices for real-time monitoring of athletes during exercise activities.
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