Polyimide tape Archives - INFRACHIP

Tag Archive for: Polyimide tape

Direct laser writing (DLW) facilities

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Direct laser writing is a fabrication technique that uses a focused laser beam to create precis...

Access Provider / Facilities

Tyndall

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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