High Vacuum Physical vapor deposition incl. mask alignment
About
For the deposition of functional films made from metals or organic materials a UNIVEX 350 High Vacuum PVD enables precision deposition rates and amounts. Shadow masks can be used for structuring whereby the mask alignment station enables precise deposition in multilayer processes.
Description
The UNIVES 350 is a highly versatile thin film deposition machine enabling metal and organic thin film deposition. The setup is made in such a way that fully functional devices can be purely vacuum deposited without preaching the vacuum. Using separate chambers minimizes cross contamination resulting in much higher performances and yields. Shadow masks can be incorporated to structure areas for application like active matrices and so on.
Technical specifications:
High vacuum PVD
– Thermal evaporation, e-beam evaporation of organic and metal thin films
– Sputtering of metal and metal oxide thin films
– Evaporation of OSCs in separate chamber connected to metal chamber by load-lock
– Control of thickness to nm-precision
– Substrate rotation
– Substrate size up to 150mm x 150mm
Alignment Station:
– Magnetic holding of shadow masks
– Sample size up to 4”
– X, Y, Z movements of masks controllable in the 5-µm regime (vicinity of substrate)
– Stereo zoom microscope
Case study:
Active matrices are required for sensor network readings thereby minimizing the electronic overhead. The fabrication of C8-BTBT thin film transistors requires the organic deposition as well as metal contacts. Using the evaporation station the various steps can be fulfilled without preaching the vacuum, so that oxygen contamination is prevented. This provides then information on the device performance without the strong impact of oxygen.
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