IntelliFAB Laser Station
About
IntelliFAB Laser Station is a large-sample machine offering precise and fast structuring of various materials by femto laser ablation. It allows for precisely cutting, drilling or structuring materials with minimal heat damage and is ideal for fine work on metals, glass, ceramics, semiconductors, polymers, and other materials in high-tech manufacturing and research.
Description
IntelliFAB laser station is a high-precision tool designed for micro- and nano-structuring of a wide range of materials. It utilizes femtosecond or picosecond laser pulses, which deliver extremely short bursts of high energy to the material surface. These ultrafast pulses enable cold ablation, minimizing thermal damage to the sample and allowing for highly accurate machining, drilling, cutting, or surface modifications. The system is equipped with beam delivery optics, galvo scanner, motion control stages, and software for pattern design and automation, making it ideal for applications in electronics, photonics, medical devices, and advanced manufacturing. The system also enables lithographical and waveguiding applications.
Technical specifications:
– 400mm x 400 mm maximum travel range of mechanical axes
– laser sources with pulse durations between 180 fs and 10 ps
– laser repetition rates (frequency range): from single shot to 50 MHz
– laser output power: up to 100 W (@IR)
– laser pulse energies: several tens of micro Joule
– laser wavelengths for structuring: IR, green, UV
– laser spot diameter (resolution) corresponds to selected optics and laser wavelength and is typically in the range of a few microns
– maximum laser spot velocity up to several meters per second
Case study:
A company is developing 3D-stacked semiconductor chips with through-silicon vias (TSVs) and complex interconnect architectures. The task is to prototype and optimize micro-scale structures in silicon and advanced materials like low-k dielectrics and compound semiconductors. The user needs to structure deep micro-trenches and vias with high precision in silicon wafers, and pattern delicate insulating layers without causing cracks or thermal degradation. By choosing the IntelliFAB Laser Station as structuring tool the user will benefit from ultrashort laser pulses enabling non-thermal ablation of silicon and low-k materials, avoiding heat damage or stress. The depth-controlled ablation and multi-layer processing allows to create high-aspect-ratio features critical for 3D integration. Finally, the user achieves rapid, precise, and clean structuring across multiple material types, significantly reducing development cycles and enabling faster prototyping of cutting-edge chip architectures.
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