Multi-layer PCB manufacturing
About
Manufacturing of single and multi-layer PCBs for RF components and RF circuits
Description
This manufacturing suite consists of a PCB plotter, a via copper plating machine, and a PCB press that enable the fabrication of complex radio-frequency (RF) multi–layer PCB designs. It facilitates manufacturing of multilayer circuits/components having multiple dielectric and metallic layers, through hole via holes and cavities.
Technical specifications:
PCB plotter
Maximum PCB size: 228.6 mm x 304.8 mm
Min./Max. through-hole vias diameter = 0.15 mm/ 3 mm
Min. gap between tracks = 0.15 mm
Through-hole via copper platter
Via copper thickness (typ.) = 3-4 µm
Multi-layer PCB press
Max. multi-layer PCB stack up thickness= 4.65 mm
Number of layers: 2-8 depending on thickness
Case study:
The multi–layer PCB manufacturing facility allowed the implementation of a 2-core proof-of-concept sub-6 GHz radiofrequency (RF) front end prototype for 5G applications. The design included a complex integration including surface-mounted transistors and inductors, in addition to distributed–element and substrate integrated waveguide (SIW) devices such as passive bandpass filters, power splitters, and transmission lines.
Optional:
Paper(s)/presentation(s): 10.1109/TCSI.2024.3419583.
Typical Application/Project: RF front-ends for multiple communication standards (i.e. 5G FR1, FR2 and FR3, Satellite, mmWave, etc.)
Access Provider / Facilities
