TRAINING

Integrated training

Integrated training courses are built on the concept of Training Fab and comprise a combination of theoretical and hands-on practical parts

INFRACHIP will offer Training Fab courses for both silicon processing and flexible electronics to students and professionals who want to learn more about device fabrication steps, equipment used for the processing and quality checks in place. 

  • Courses vary from short (2 full days) to long (2 full weeks) and will be adapted to the needs of international visitors. 
  • At the end of the course, the participants become familiar with basic fabrication principles, process steps, equipment and techniques of device fabrication and characterisation.

For Junior researchers and PhD, please also check the Research Accelerator Programme!

Next trainings:

DIGITAL SCHOOL – “SENSE”

November 5th 2024 – November 26th 2025
Organised by INL
Registration by November 4th 9am CET

INFRACHIP is organising its first Digital School, with an online series of webinars dedicated to provide and update information on advanced sensing technologies, spanning multiple different types of sensors—magnetic, optical, electronic, chemical, biological, mechanical—and different types of materials and structures used to implement them—from micro- and nanofabricated stacks of metallic, insulating, or semiconductor layers, to flexible substrates, to microfluidic platforms, to advanced materials such as graphene.

The Programme is as follows:

“Adapting sensors to specific challenges can be difficult. However, polymers such as chitosan, poly-lactic acid, and PVDF-TrFE offer new possibilities for sensor integration, especially with additive manufacturing techniques like printing. In addition to an introduction to basic sensor concepts, this webinar will focus on the fundamentals of ferroelectric PVDF-TrFE and demonstrate how this piezoelectric material can be fabricated for various sensor applications, with numerous examples from both research and industry.”

This webinar will introduce integrated photonics, beginning with its historical development in the late 1960s and early 1970s and discussing the significant growth of the field in the 2000s driven by telecommunications demands. We will explore the most popular material platforms—such as Silicon-on-Insulator (SOI), Indium Phosphide (InP), and Silicon Nitride (SiN)—highlighting their wavelength ranges and typical component libraries.
Next, we will provide an overview of how photonic integrated circuits are fabricated using these material platforms, including a discussion on the advantages and disadvantages of fabricating active components. The seminar will then focus on the application areas of photonic integrated circuits in sensing technologies. This includes an examination of LiDAR systems, microfluidic sensors, gas sensors, and gyroscopes, among others.
Finally, we will address the integration of photonic integrated circuits into sensor systems. Topics will include integration with control electronics, methods of coupling light using fiber optics and lenses, temperature stabilization techniques, and packaging considerations. This seminar is designed for attendees with various backgrounds in photonics and aims to provide a comprehensive overview of integrated photonic sensing technologies.

This talk will present work undertaken within the Sustainable Agri-Food and Environment strategic research cluster at Tyndall and explain how this work feeds into Infrachip and how we can contribute and collaborate through this project.

‘The demand for advanced functionalities in electronic devices is gaining traction in the scientific and industrial communities. In this context, printed electronics offer several advantages, such as low-cost processing and large-scale production compatibility, and are being studied for a wide range of applications in a variety of industries, including sensors, actuators, and electronics. Printing techniques, such as screen or inkjet printing, enable the production of electronic devices that are low in cost, easily scalable for industrial production, and flexible, while also being a more environmentally friendly technology. An ink typically contains at least three major components: nano- or microparticles, organic binder/additive dispersed or dissolved in solvent(s).
Among the different materials, graphene is one of the most suitable materials for the development of inks. Reduced graphene oxide is a two-dimensional (2D) material with exceptional mechanical, thermal, and electrical properties, making it an excellent choice for printed flexible electronics. Unlike metals, which may be scarce and cause environmental issues during extraction and refining, graphene can be produced from graphite in a highly scalable manner.
Most graphene inks use organic solvents such as N-methyl-2-pyrrolidone (NMP) and dimethylformamide (DMF), both of which are toxic even at low concentrations, making them unsuitable for industrial production. As a result, there is an urgent need to replace those solvents with environmentally friendly alternatives. Bio-based solvents such as p-cymene, cyrene, cyclopentyl methyl ether (CPME), 2-methyl tetrahydrofuran (2-MeTHF), and dimethyl sulfoxide (DMSO) are viable options for developing printable high-performance devices.
This work will present several environmentally friendly formulations. Water-soluble polyvinylpyrrolidone (PVP), the natural and water-soluble polymer carboxymethyl cellulose (CMC), a chemical, thermal, and radiation-resistant polymer, poly(vinylidene fluoride) (PVDF), and elastomeric styrene-ethylene-butylene-styrene (SEBS) have all been used to create a variety of formulations. To achieve good rheological properties, the formulations were optimised in terms of the filler/binder ratio and solid content. The screen-printed films can achieve sheet resistance lower than Rsq< 100 Ω/sq. Furthermore, the multifunctionality of the inks is demonstrated by their use in a variety of sensing applications, including thermosensitive, piezoresistive, an 8-inch capacitive touch sensor, and humidity sensors. The materials’ multifunctionality is demonstrated, as is their potential for printed electronics while remaining environmentally friendly and biocompatible, with the PVP formulation capable of being thermoformed.’

INFRACHIP SCHOOL

October 2024 – February 2025
Organised by the Hellenic Mediterranean University (HMU)
Registration closed on October 7th 2pm CEST

2D Materials for Flexible Energy Harvesting and Storage Devices


“2D Materials for Flexible Energy Harvesting and Storage Devices” focuses on utilizing advanced 2D materials like graphene and dichalcogenides to develop innovative, flexible energy solutions. This includes processing these materials for additive manufacturing, creating printable and sprayable formulations, and optimizing their properties through functionalization and doping. The field also explores organic and perovskite solar cells, emphasizing improved performance and stability. Additionally, it involves the industrialization of printing processes for photovoltaic modules and the development of printed and flexible electronics for various applications, including smart wearables and IoT. These efforts aim to enhance device performance and create efficient, flexible energy harvesting and storage solutions.


HMU is preparing the first INFRACHIP School, divided into two parts:

  • Digital learning: October 14-18th, 2024, with a series of webinars

  • Hands-on practice and training: February 24-28th at HMU, Greece

– 2D materials based ink formulation and characterization

– 2D material enabled energy harvesters and storage units fabrication

– Device demonstrations characterization


Information:

The INFRACHIP school is open to Master and PhD students, research staff, engineers.

The school is composed of an online part and a hands-on training, which will take place at HMU in February 2025. Applicants who successfully attend the first part of the school and pass the final test will be eligible to attend the hands-on training.

Applicants are responsible for their own travel and accommodation expenses. In case of EU applications, applicants should seek opportunities through EU mobility programs such as Erasmus. The same can be the case for international applications. 

Training opportunities through our partners

INFRACHIP plans to provide many other training opportunities, thanks to its consortium network. Summer or Winter school will be organised, as well as hybrid training. 

More information about it will be added here.