Photolithography
Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive material deposited on a substrate.
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Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive material deposited on a substrate.
Rapid Thermal Processing (RTP) is a heat treatment where semiconductor substrates or other materials are exposed to high temperatures for short periods of time with ramp rates typically in the range from 100 to 300 °C/s.
Metal evaporation is a versatile high-vacuum physical vapour deposition technique for producing metal coatings.
Implantation of atoms or molecules into a solid to modify its physicochemical properties. This technique is widely used for the fabrication of active electronic components like diodes and transistors.
Thermal treatments at atmospheric pressure in hot-walled quartz tube furnaces under oxidizing or neutral / forming gas ambient.
Electron beam lithography (EBL) is a versatile mask-less (“direct-write”) patterning technique based on the exposure of an electron-sensitive material (termed as resist) to a focused electron beam.
Dry Etching of dielectric, semiconductor and metal layers using Reactive Ion Etching (RIE) and Atomic Layer Etching (ALE) modes
Dicing of substrates into individual units by using a circular saw fitted with a thin diamond blade.
TITLE: European Research Infrastructure on Semiconductor Chips
START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01
Coordinator: Tyndall National Institute
INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822
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