SUSTAIN - INFRACHIP

TECHNOLOGIES

Here are listed all the required processing steps and technologies for developing sustainable low-power electronics with low manufacturing cost and low environmental impact during manufacturing.

SUSTAIN

Green Electronics & Substrates

UNOVA, HMU and JOR will have their technology offerings under this platform. This technology pillar offers users economically and environmentally sustainable routes to prepare substrates, inks, films and devices, that can be used as standalone projects or as components for the integration of systems. The platform also offers characterization facilities. The offering will be on semiconductor and flexible substrates.

Green Sensors

Tyndall and WUT/ CEZAMAT will have their offerings under this platform. Under this platform there will be offerings to develop LIG sensors both of flexible and wafer substrates. It will have on offering development of electronic structures such as luminescent displays, textronic materials and graphene electrodes on flexible and stretchable substrates such as polymer film, common fabrics and paper.

Hybrid SiP/SoC

WUT/CEZAMT and Tyndall will offer their Hybrid and heterogeneous integration capabilities under this technology pillar. The offering will have the capability to perform the assembly using a Finetech Flip-Chip Pico device or a small, self-built heating press, allowing for multiple connections to be made at the same time. The platform will offer the Micro Transfer Printing technology for packaging.

Flexible substrates

Showroom UNINOVA Dielectric deposition, Mechanical, Metrology / Characterisation, Optical, Others, Physical/Structural, Processing/Fabrication Green electronics and substrates, Sustain

UNINOVA provides a comprehensive suite of resources encompassing all aspects of flexible substr...

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UNINOVA

R2R UV-Nanoimprinting

Showroom JOANNEUM RESEARCH Devices / Test structures, Printing, Processing/Fabrication Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Our roll-to-roll nanoimprinting machine facilitates continuous and therefore cost-effective pro...

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JOANNEUM RESEARCH

Inorganic nano-powder synthesis

Showroom HMU Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Physical/Structural, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Inorganic nano-powder synthesis facility- virtually any material in grams scale for compounds t...

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HMU

Battery Energy Storage

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, Sustain

Simulation and processing of battery energy storage materials and architectures for integration...

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Tyndall

Smart Systems Design, Characterisation and Prototyping Facility

Showroom Tyndall Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural, Processing/Fabrication Connect, Power, Sustain, Think

This is a suite of test equipment that offers a turnkey electronics system design, manufacture,...

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Tyndall

Photolithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive ma...

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NCSR Demokritos

Rapid Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Rapid Thermal Processing (RTP) is a heat treatment where semiconductor substrates or other mate...

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NCSR Demokritos

Metal Evaporators

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Metal evaporation is a versatile high-vacuum physical vapour deposition technique for producing...

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NCSR Demokritos

Ion Implanter

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Implantation of atoms or molecules into a solid to modify its physicochemical properties. This ...

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NCSR Demokritos

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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