sieving Archives - INFRACHIP

Tag Archive for: sieving

Milling and size separation

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Powders processing by milling and dimensional separation....

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HMU

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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