THINK

TECHNOLOGIES

Access novel components for energy-efficient computing paradigms based on novel logic switches and on beyond CMOS and von Neumann architectures. These include technology blocks for quantum and spin device engineering and components for brain-inspired/neuromorphic computing, thereby enabling to explore solution for intelligence-on-the-edge and accelerators for the future edge-computing.

Quantum and spin device engineering

The technology offering in this section will be offered by Chalmers, INL and Tyndall. The offering will have a full set of tools for processing of quantum and spin devices. The toolset include for example Electron beam lithography , direct write laser lithography , Dry etch , ALD of Al2O3, AlN, HfO2, SiO2, Ta2O5 (Oxford FlexAl), Metal evaporator Ti, Al, Cr, Au, Ge, Pd, Ni, Pt, Ag, Cu, V, Fe, Co, Al2O3 and Ta Aluminium evaporator and Ion beam etching On the characterisation side there will access to Ellipsometer, SEM, automated optical microscope, and various surface profilers and SPM.

The platform will also have facilities to fabricate spintronic devices, quantum devices like quantum dots, wells etc.

Components for neuromorphic computing

Under this technology pillar UNOVA, HMU, AMO and NCSRD will have their offereings. Installations are offered to advance neuromorphic computing research using oxide semiconductor-based technology on rigid or flexible substrates. There will be offerings on printed electronics, supported miniaturized circuits, portable energy devices and assembly of self-powered, flexible platforms for agriculture, smart wearables, IoT and industry 4.0 applications, neuromorphic computing using photonic reservoir computing chips, non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes etc.

Non volatile memories

NCSRD -INN will offer their non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes under this technology pillar.

Characterization

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m². High-end production f...

Access Provider / Facilities

AMO GmbH

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822