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You are here: Home1 / Think2 / Component Neuromorphic computing

Asylum Research PFM/MFM

Showroom Tyndall Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Asylum Research MPD-3D Atomic Force Microscope (AFM) (https://afm.oxinst.com/ ) for characteris...
Access Provider / Facilities
Tyndall
December 23, 2024
https://infrachip.eu/wp-content/uploads/2025/04/Tyndall.png 476 602 Lina Jarboui https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Lina Jarboui2024-12-23 10:41:122025-04-23 10:45:02Asylum Research PFM/MFM

Packaging

Showroom CNRS-FMNT Backend, Packaging, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Green electronics and substrates, Green sensors, Photonic sensing, Power, Power electronics, Quantum and spin devices engineering, RF components, Sense, Stretchable and flexible sensors, Sustain, Think
Packaging integrates the front-end through wafer sealing, electro plating, CMP, 3D co-integrati...
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CNRS-FMNT
November 24, 2024
https://infrachip.eu/wp-content/uploads/2025/03/CNRS_FMNT_Packaging_PTALTM-scaled.jpg 2560 2560 Lina Jarboui https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Lina Jarboui2024-11-24 14:27:392025-04-23 10:49:00Packaging

Deposition Microfabrication Tools

Showroom CNRS-FMNT Dielectric deposition, Metal deposition, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Green electronics and substrates, Green sensors, Photonic sensing, Power, Power electronics, Quantum and spin devices engineering, RF components, Sense, Stretchable and flexible sensors, Sustain, Think
Deposition equipment and processes can produce thin films of up to several microns of metal and...
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CNRS-FMNT
November 24, 2024
https://infrachip.eu/wp-content/uploads/2025/03/CNRS_FMNT_Deposition_PTALTM-scaled.jpg 2560 2560 Lina Jarboui https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Lina Jarboui2024-11-24 13:53:222025-03-24 14:02:36Deposition Microfabrication Tools

Lithography

Showroom CNRS-FMNT e-beam lithography, Inprint Lithography, Laser lithography, Optical lithography, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Green electronics and substrates, Green sensors, Photonic sensing, Power, Power electronics, Quantum and spin devices engineering, RF components, Sense, Stretchable and flexible sensors, Sustain, Think
Lithography equipment and processes enable the fabrication of micron, submicron, and nanometric...
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CNRS-FMNT
October 24, 2024
https://infrachip.eu/wp-content/uploads/2025/03/CNRS_FMNT_Lithography_PTALTM-scaled.jpg 2560 2560 Lina Jarboui https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Lina Jarboui2024-10-24 14:20:172025-03-24 14:25:52Lithography

Ion Beam Etching (IBE) and Ion Beam deposition (IBD) tool.

Showroom CNRS-FMNT Dielectric deposition, Dry etching, Plasma etching, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, Sense, Think
The equipment is capable of ion beam etching and ion beam deposition of materials while maintai...
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CNRS-FMNT
October 24, 2024
https://infrachip.eu/wp-content/uploads/2025/03/IBE_IBD_PTALTM.png 411 409 Lina Jarboui https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Lina Jarboui2024-10-24 14:11:132025-03-24 14:11:46Ion Beam Etching (IBE) and Ion Beam deposition (IBD) tool.

Inorganic nano-powder synthesis

Showroom HMU Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Physical/Structural, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
Inorganic nano-powder synthesis facility- virtually any material in grams scale for compounds t...
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HMU
October 15, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Chemistry_1-1.jpg 317 200 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-10-15 12:20:402024-10-17 14:25:19Inorganic nano-powder synthesis

Thermal processing

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think
Dry oxidation furnace: Centrotherm Wet Oxidation furnace: Centrotherm Low Pressure Chemical V...
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AMO GmbH
October 10, 2024
https://infrachip.eu/wp-content/uploads/2024/04/5_main-Collage-Tool-Operation.jpg 551 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-10-10 13:43:492024-10-17 14:23:53Thermal processing

Photolithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive ma...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/21-1.png 226 312 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 15:02:442024-07-24 06:55:29Photolithography

Rapid Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Rapid Thermal Processing (RTP) is a heat treatment where semiconductor substrates or other mate...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/19-1.png 386 289 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 14:57:452024-07-23 14:57:45Rapid Thermal Processing

Metal Evaporators

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Metal evaporation is a versatile high-vacuum physical vapour deposition technique for producing...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/17-1.png 252 329 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 14:06:522024-07-23 14:06:52Metal Evaporators
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Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

Contact us

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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