Evatec Clusterline 200 Archives - INFRACHIP

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Piezoelectric Al1-xScxN thin-film stack

Showroom Tyndall Dielectric deposition, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

Tyndall National Institute offers Piezoelectric Al1-xScxN thin-film with Sc concentration of 6%...

Access Provider / Facilities

Tyndall

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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