Process Integration Archives - INFRACHIP

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Advanced PiezoMEMS device design and fabrication

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...

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Tyndall

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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