At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providing comprehensive services from design to fabrication with state-of-the-art piezoelectric materials such as AlScN, Lithium Niobate, and Lithium Tantalate, including their insulator variants LNOI and LTOI. Our facilities offer a complete suite of microfabrication processes, capable of producing advanced devices like RF MEMS resonators and Piezoelectric Energy Harvesters. Targeting sectors from RF communications to biomedical and IoT, we deliver technology solutions that advance Infrachip research objectives.


Key Technology Offerings:

a) Advanced Piezoelectric Materials: Utilization of high-performance materials including AlN, AlScN, Lithium Niobate, Lithium Tantalate, LNOI, and LTOI for superior device performance.
b) Comprehensive Design and Simulation: Expertise in the conceptualization, design supported by COMSOL Multiphysics simulation of PiezoMEMS devices to ensure optimal performance before fabrication.
c) Microfabrication Processes: A wide range of state-of-the-art microfabrication capabilities, including:
i) Piezoelectric thin-film deposition via magnetron sputtering
ii) Advanced lithography (optical and e-beam)
iii) Precise etching techniques (dry etching, DRIE)
iv) Au lift-off
vi) Metal (Mo, Al) dry etch
vii) Polymer (BCB, Intervia and Polyimide) deposition and etching
viii) Thin-film encapsulation (using oxide and nitride) micro devices
ix) HF vapour etching for sacrificial release
d) Process Integration and PDK Development: Integration of complex processes into streamlined workflows supported by the development of process design kits (PDK) for enhanced efficiency and reproducibility.
e) Characterization and Testing: Extensive characterization capabilities using SEM, FIB, EDX, alongside electrical and mechanical testing at both die-level and wafer-level to ensure device integrity and performance.
f) Micro Transfer Printing Compatibility: Development of devices compatible with Micro Transfer Printing for post-fabrication heterogeneous integration, broadening application possibilities.

Our technologies are instrumental in a variety of sectors, with tailored applications that leverage the unique properties of the PiezoMEMS devices:
a) RF Communications: Design and fabrication of RF MEMS resonators (SAW, BAW, FBAR, XBAR, LWR, SMR) for use in filters, advancing 5G and 6G technology infrastructure with improved efficiency and performance.
b) Biomedical Devices: Development of PMUTs and piezoelectric micropumps, offering innovations in drug delivery systems,  diagnostic instruments, and patient monitoring technologies.
c) Energy Harvesting: Creation of Piezoelectric Energy Harvesters for sustainable, efficient power solutions in remote or wireless applications, crucial for environmental monitoring and IoT sensor nodes.
d) Gas Sensing and IoT: Piezoelectric devices tailored for gas sensing applications, enhancing safety and environmental monitoring, as well as diverse IoT applications requiring reliable and precise sensor technology.

The Tyndall National Institute stands ready to collaborate with partners in the European INFRACHIP research platform, offering our advanced PiezoMEMS technology services to drive innovation and technological advancement across multiple sectors. Our commitment to excellence ensures that our partners have access to cutting-edge solutions for their most challenging projects.

Technical specifications:

Piezoelectric Materials:
i) Aluminum Scandium Nitride (AlScN)
ii) Lithium Niobate (LiNbO3)
iii) Lithium Tantalate (LiTaO3)
iv) Lithium Niobate on Insulator (LNOI)
v) Lithium Tantalate on Insulator (LTOI)

Piezoelectric device processing capabilties:
i) Wafer processing capability: 100 mm (4 inch)
ii) Thin-Film deposition of AlN / AlScN: Magnetron sputtering
iii) Optical Lithography: upto 1 µm minimum feature size
iv) E-beam lithography: 100 nm as minimum feature size
v) Etching: Dry etching, Deep Reactive Ion Etching (DRIE), Wet etching, HF Vapour etch
vii) Metal and Polymer deposition
viii) Thin-film encapsulation using oxide and nitride

Design and Simulation:
i) Tools: COMSOL Multiphysics
ii) Design Kit: Process Design Kit (PDK) development for streamlined fabrication processes

Characterization Techniques:
i) Scanning Electron Microscopy (SEM)
ii) Focused Ion Beam (FIB)
iii) Energy Dispersive X-ray Spectroscopy (EDX)
iv) XRD
v) Ellipsometry

Electrical Testing: Die-level and wafer-level device probing and testing for functionality and performance verification. For RF devices, the S-parameters can be extracted using a Network Analyzer followed by extraction of the lumped parameters using mBVD model to understand the device properties. Similarly, by probing ultrasonic devices, the impedance parameters can be extracted using an LCR meter.

Mechanical Testing:
i) Nano-indenter: The mechanical properties like the elastic modulus of the deposited thin-films can be extracted using the tool.
ii) Polytec Laser Doppler Vibrometer – The electromechanical response of the fabricated devices can be measured using the Polytec Laser Doppler Vibrometer (LDV) when electrically actuated.

Device Types:
i) RF MEMS Resonators (SAW, BAW, FBAR, XBAR, LWR, SMR)
ii) Piezoelectric Transformers
iii) Piezoelectric Micromachined Ultrasonic Transducers (PMUTs)
iv) Piezoelectric Energy Harvesters
v) Piezoelectric Micropumps

Special Features:
a) Micro Transfer Printing Compatibility: The piezoelectric device fabrication processes can be modified to make the devices transfer printable, significantly enhancing the flexibility and application scope of MEMS devices.
b) Interconnect Development/RDL Development: Post Micro Transfer Printing, we offer advanced interconnect development or Redistribution Layer (RDL) development, ensuring seamless electrical connectivity and integration of transferred devices into their new systems.


[1] DOI: 10.1109/EFTF/IFCS57587.2023.10272056

[2] DOI: 10.1109/TRANSDUCERS.2019.8808627 

[3] https://doi.org/10.1016/j.sna.2017.08.005

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