Advanced sensing Archives - Page 4 of 6

Electronic Component Packaging

Showroom Tyndall Advanced sensing, Connect, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, Sense, Stretchable and flexible sensors, Sustain

The Tyndall Packaging Laboratory offers a comprehensive range of component assembly capabilitie...

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Tyndall

Raman confocal microscope

Showroom Tyndall Metrology / Characterisation, Optical, Physical/Structural Advanced sensing, Component Neuromorphic computing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Quantum and spin devices engineering, Sense, Stretchable and flexible sensors, Sustain, Think

Raman confocal microscope for characterisation of materials...

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Tyndall

Suite

Showroom Tyndall Electrical, Metrology / Characterisation, Physical/Structural Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Suite of potentiostats: - Single and bi-potentiostats - Multiplexer modules - Impedance Spec...

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Tyndall

Micro/Nano electrodes for electrochemistry

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Sense

On chip micro/nanoelectrodes fabricated at Tyndall can be tailored and/or modified for electroc...

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Tyndall

High resolution 3D-printer

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

High resolution 3D-printer for prototyping of fluidic cell or other mechanical parts....

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Tyndall

Equipment offering: Piezoelectric coefficient d33 measurement

Showroom Tyndall Dielectric deposition, Electrical, Metal deposition, Metrology / Characterisation, Processing/Fabrication Advanced sensing, Connect, Energy autonomy, Power, RF components, RF front-end design, Sense

d33 indicates charge per unit force in the polarisation direction a piezoelectric sample. In Ty...

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Tyndall

Piezoelectric Al1-xScxN thin-film stack

Showroom Tyndall Dielectric deposition, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

Tyndall National Institute offers Piezoelectric Al1-xScxN thin-film with Sc concentration of 6%...

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Tyndall

Advanced PiezoMEMS device design and fabrication

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...

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Tyndall

Transfer printing for heterogeneous integration

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Suitably prepared photonic or electronic components can be heterogeneously integrated by transf...

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Tyndall

XPS and Surface Analysis

Showroom INL Metrology / Characterisation, Physical/Structural Advanced sensing, Sense, Stretchable and flexible sensors

A vacuum system that combines surface analysis methods for characterization of thin solid films...

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INL

Electronic Component Packaging

Raman confocal microscope

Suite

Micro/Nano electrodes for electrochemistry

High resolution 3D-printer

Equipment offering: Piezoelectric coefficient d33 measurement

Piezoelectric Al1-xScxN thin-film stack

Advanced PiezoMEMS device design and fabrication

Transfer printing for heterogeneous integration

XPS and Surface Analysis

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