Failure analysis Archives - INFRACHIP

Tag Archive for: Failure analysis

Thin-film circuits for sensors

Showroom UNINOVA Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Others, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Sense, Stretchable and flexible sensors

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UNINOVA

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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