![](https://infrachip.eu/wp-content/uploads/2024/04/07_optomec_1-495x400.jpg)
Aerosol-Jet 300 Optomec
Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Energy autonomy, Green sensors, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, SustainThe Aerosol Jet technology enables printing of functional inks on both 2D and 3D substrates....
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JOANNEUM RESEARCH
![](https://infrachip.eu/wp-content/uploads/2024/04/05_PicoJetter-Dispenser_-Nordson-495x400.jpg)
PicoJetter – Dispenser
Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Energy autonomy, Green sensors, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, SustainThe Nordson EFD system is a multifunctional deposition tool for inks and paste over a wide visc...
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JOANNEUM RESEARCH
![](https://infrachip.eu/wp-content/uploads/2024/04/04_Pixdro1-495x400.jpg)
PIXDRO/LP50 InkJetPrinter
Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, SustainThe PiXDRO LP50 enables multi-material 2D and 3D inkjet printing....
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JOANNEUM RESEARCH
![](https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Modix_1-495x400.jpg)
Modix 60
Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, ThinkLarge size parts manufacturing with the material extrusion 3D printing method....
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HMU
![](https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Intamsys_1-495x400.jpg)
Intamsys Funmat HT
Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, ThinkParts manufactured with the material extrusion 3D printing method from various polymeric materi...
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HMU
![](https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Formlabs_1-495x400.jpg)
Formlabs 3B+
Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, ThinkParts manufactured with the vat photopolymerization 3D printing method from various polymeric r...
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HMU
![](https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_envisiontec_1-495x400.jpg)
EnvisionTec developer bioplotter
Showroom HMU Dielectric deposition, Dry etching, Magnetic, Metal deposition, Metrology / Characterisation, Optical, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think3D bioplotter capable for the manufacturing of biocompatible materials with the bioplotting 3D ...
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HMU
![](https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_3Dgence_1-495x400.jpg)
3Dgence F420
Showroom HMU Dielectric deposition, Dry etching, Mechanical, Metal deposition, Metrology / Characterisation, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, ThinkIndustrial specifications 3D printer capable for the manufacturing of the biocompatible PEEK po...
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HMU
![](https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_3devo_1-495x400.jpg)
3devo composer 450
Showroom HMU Dielectric deposition, Dry etching, Metal deposition, Metrology / Characterisation, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, ThinkFilament composer compatible with the material extrusion 3D printing method from various polyme...
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HMU
![](https://infrachip.eu/wp-content/uploads/2024/04/Tyndall_11.jpg)
High resolution 3D-printer
Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, SustainHigh resolution 3D-printer for prototyping of fluidic cell or other mechanical parts....
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Tyndall