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You are here: Home1 / Think2 / Component Neuromorphic computing

Ion Implanter

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Implantation of atoms or molecules into a solid to modify its physicochemical properties. This ...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/15-1.png 287 327 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 14:00:222024-07-23 14:00:22Ion Implanter

Furnace Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Thermal treatments at atmospheric pressure in hot-walled quartz tube furnaces under oxidizing o...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/13-1.png 292 308 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 13:54:392024-07-23 13:54:39Furnace Thermal Processing

Electron Beam Lithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Short-range optical communications, Sustain, Think
Electron beam lithography (EBL) is a versatile mask-less (“direct-write”) patterning techni...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/10-1.png 228 310 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 13:29:542024-07-23 13:29:54Electron Beam Lithography

Dry (Plasma) Etching

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Dry Etching of dielectric, semiconductor and metal layers using Reactive Ion Etching (RIE) and ...
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NCSR Demokritos
July 23, 2024
https://infrachip.eu/wp-content/uploads/2024/07/9-1.png 566 471 Matthieu Martin https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png Matthieu Martin2024-07-23 13:09:422024-07-23 13:09:42Dry (Plasma) Etching

LPCVD

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Low-Pressure Chemical Vapor Deposition (LPCVD) is a thermal process used to produce thin films ...
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NCSR Demokritos
July 22, 2024
https://infrachip.eu/wp-content/uploads/2024/07/8.png 351 417 martina.desio https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png martina.desio2024-07-22 14:11:042024-07-22 14:21:41LPCVD

High Performance Computing

Showroom Tyndall Modelling / Database, Others Advanced sensing, Component Neuromorphic computing, Connect, Green electronics and substrates, Green sensors, Quantum and spin devices engineering, Sense, Short-range optical communications, Sustain, Think
Tyndall hosts a 3,000 CPU High Performance Computing (HPC) Cluster that runs a broad range of a...
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Tyndall
July 20, 2024
https://infrachip.eu/wp-content/uploads/2024/12/HPC-cluster.png 467 933 pascale.caulier https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png pascale.caulier2024-07-20 16:35:192024-12-20 16:35:34High Performance Computing

X-ray and ultraviolet photoelectron spectroscopy (XPS/UPS)

Showroom UNINOVA Electrical, Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Quantum and spin devices engineering, Sense, Stretchable and flexible sensors, Sustain, Think
UNINOVA offers characterization of surfaces in terms of chemical (oxidation states) and element...
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UNINOVA
June 6, 2024
https://infrachip.eu/wp-content/uploads/2024/06/XPS.jpg 869 1047 pascale.caulier https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png pascale.caulier2024-06-06 15:29:162024-06-06 15:29:59X-ray and ultraviolet photoelectron spectroscopy (XPS/UPS)

Atomic Force Microscope (AFM)

Showroom UNINOVA Electrical, Magnetic, Mechanical, Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Green sensors, Power, Quantum and spin devices engineering, Sense, Stretchable and flexible sensors, Sustain, Think
An AFM works by quasi-physically probing a surface, allowing to generate not only topography im...
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UNINOVA
June 6, 2024
https://infrachip.eu/wp-content/uploads/2024/06/AFM_1.jpg 2048 2048 pascale.caulier https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png pascale.caulier2024-06-06 14:58:152024-06-06 14:58:15Atomic Force Microscope (AFM)

Atomic Force Microscope

Showroom Tyndall Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Bruker Atomic Force Microscope (AFM) – Dimension Icon...
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Tyndall
May 2, 2024
https://infrachip.eu/wp-content/uploads/2024/05/Tyndall_AFM.jpg 312 353 pascale.caulier https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png pascale.caulier2024-05-02 12:09:312024-05-03 08:03:25Atomic Force Microscope

Flexifab Nanofabrication Cleanroom

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Access to Tyndall FlexiFab Clean Room for non-standard processing...
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Tyndall
May 2, 2024
https://infrachip.eu/wp-content/uploads/2024/05/Tyndall_Flexifab.jpg 498 708 pascale.caulier https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png pascale.caulier2024-05-02 11:45:122024-05-03 08:04:14Flexifab Nanofabrication Cleanroom
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Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

Contact us

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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