Hybrid SiP/SoC – Page 4 – INFRACHIP

Physico-chemical Characterisation

Showroom CNRS-FMNT Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain

The Physico-chemical Characterisation - IMPACT platform integrates several physico-chemical ch...

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Terahertz characterisation

Showroom CNRS-FMNT Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Terahertz characterisation - PLATERA platform: Terahertz (50 GHz – 4 THz) characterization an...

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Hyperfrequency Characterisation Platform

Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Connect, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, RF components, RF front-end design, Sustain

This platform is dedicated to the analysis and characterization, on a wide band of frequency, o...

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Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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