THINK - INFRACHIP

TECHNOLOGIES

Access novel components for energy-efficient computing paradigms based on novel logic switches and on beyond CMOS and von Neumann architectures. These include technology blocks for quantum and spin device engineering and components for brain-inspired/neuromorphic computing, thereby enabling to explore solution for intelligence-on-the-edge and accelerators for the future edge-computing.

THINK

Quantum and spin device engineering

The technology offering in this section will be offered by Chalmers, INL and Tyndall. The offering will have a full set of tools for processing of quantum and spin devices. The toolset include for example Electron beam lithography , direct write laser lithography , Dry etch , ALD of Al2O3, AlN, HfO2, SiO2, Ta2O5 (Oxford FlexAl), Metal evaporator Ti, Al, Cr, Au, Ge, Pd, Ni, Pt, Ag, Cu, V, Fe, Co, Al2O3 and Ta Aluminium evaporator and Ion beam etching On the characterisation side there will access to Ellipsometer, SEM, automated optical microscope, and various surface profilers and SPM.

The platform will also have facilities to fabricate spintronic devices, quantum devices like quantum dots, wells etc.

Components for neuromorphic computing

Under this technology pillar UNOVA, HMU, AMO and NCSRD will have their offereings. Installations are offered to advance neuromorphic computing research using oxide semiconductor-based technology on rigid or flexible substrates. There will be offerings on printed electronics, supported miniaturized circuits, portable energy devices and assembly of self-powered, flexible platforms for agriculture, smart wearables, IoT and industry 4.0 applications, neuromorphic computing using photonic reservoir computing chips, non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes etc.

Non volatile memories

NCSRD -INN will offer their non-volatile memories, and logic devices including FinFET and Junctionless nanowire Fêtes under this technology pillar.

Cleanroom Broad Fabrication Platform

Showroom Chalmers University Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers a range of cleanrooms processes for full micro/nanofabrication. Depositio...

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Chalmers University

Inorganic nano-powder synthesis

Showroom HMU Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Physical/Structural, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Inorganic nano-powder synthesis facility- virtually any material in grams scale for compounds t...

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HMU

Thermal processing

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Dry oxidation furnace: Centrotherm Wet Oxidation furnace: Centrotherm Low Pressure Chemical V...

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AMO GmbH

Smart Systems Design, Characterisation and Prototyping Facility

Showroom Tyndall Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural, Processing/Fabrication Connect, Power, Sustain, Think

This is a suite of test equipment that offers a turnkey electronics system design, manufacture,...

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Tyndall

Photolithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive ma...

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NCSR Demokritos

Rapid Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Rapid Thermal Processing (RTP) is a heat treatment where semiconductor substrates or other mate...

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NCSR Demokritos

Metal Evaporators

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Metal evaporation is a versatile high-vacuum physical vapour deposition technique for producing...

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NCSR Demokritos

Ion Implanter

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Implantation of atoms or molecules into a solid to modify its physicochemical properties. This ...

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NCSR Demokritos

Furnace Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Thermal treatments at atmospheric pressure in hot-walled quartz tube furnaces under oxidizing o...

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NCSR Demokritos

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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