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You are here: Home1 / Processing/Fabrication2 / Dry etching

Die Bonder

Showroom JOANNEUM RESEARCH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, Sustain
Tresky T3000 Pro die bonder to enable SMT assembly...
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JOANNEUM RESEARCH
April 15, 2024
https://infrachip.eu/wp-content/uploads/2024/04/06_TreskyPro1.jpg 783 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-15 11:19:032024-05-22 15:52:37Die Bonder

PicoJetter – Dispenser

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Energy autonomy, Green sensors, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, Sustain
The Nordson EFD system is a multifunctional deposition tool for inks and paste over a wide visc...
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JOANNEUM RESEARCH
April 15, 2024
https://infrachip.eu/wp-content/uploads/2024/04/05_PicoJetter-Dispenser_-Nordson.jpg 727 544 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-15 11:13:512024-05-22 15:50:42PicoJetter – Dispenser

PIXDRO/LP50 InkJetPrinter

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, Sustain
The PiXDRO LP50 enables multi-material 2D and 3D inkjet printing....
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JOANNEUM RESEARCH
April 15, 2024
https://infrachip.eu/wp-content/uploads/2024/04/04_Pixdro1.jpg 735 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-15 11:10:482024-05-22 15:48:44PIXDRO/LP50 InkJetPrinter

Modix 60

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
Large size parts manufacturing with the material extrusion 3D printing method....
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HMU
April 15, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Modix_1.jpg 980 551 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-15 10:00:272024-04-25 09:47:39Modix 60

Intamsys Funmat HT

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
Parts manufactured with the material extrusion 3D printing method from various polymeric materi...
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HMU
April 15, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Intamsys_1.jpg 858 685 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-15 09:37:502024-04-25 09:47:18Intamsys Funmat HT

Formlabs 3B+

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
Parts manufactured with the vat photopolymerization 3D printing method from various polymeric r...
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HMU
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_Formlabs_1.jpg 1233 822 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 15:48:142024-04-25 09:46:55Formlabs 3B+

EnvisionTec developer bioplotter

Showroom HMU Dielectric deposition, Dry etching, Magnetic, Metal deposition, Metrology / Characterisation, Optical, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
3D bioplotter capable for the manufacturing of biocompatible materials with the bioplotting 3D ...
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HMU
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_envisiontec_1.jpg 706 941 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 15:43:182024-04-25 09:46:31EnvisionTec developer bioplotter

3Dgence F420

Showroom HMU Dielectric deposition, Dry etching, Mechanical, Metal deposition, Metrology / Characterisation, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
Industrial specifications 3D printer capable for the manufacturing of the biocompatible PEEK po...
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HMU
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_3Dgence_1.jpg 1218 685 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 15:09:412024-04-25 09:45:523Dgence F420

3devo composer 450

Showroom HMU Dielectric deposition, Dry etching, Metal deposition, Metrology / Characterisation, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think
Filament composer compatible with the material extrusion 3D printing method from various polyme...
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HMU
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/HMU_InfraChip_Showroom_3devo_1.jpg 706 941 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 15:02:482024-04-25 09:45:143devo composer 450

Dry etching

Showroom WUT CEZAMAT Dry etching, Processing/Fabrication Energy autonomy, Photonic sensing, Power, Sense
Dry etching processes using ICP RIE plasma tool. Tool allows for cryogenic temperature processi...
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WUT CEZAMAT
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/CEZAMAT_7-dry_etching.jpg 653 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 14:37:132024-04-15 13:05:26Dry etching
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Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

Contact us

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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