devinf20, Author at INFRACHIP - Page 3 of 11

About devinf20

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Entries by devinf20

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Energy autonomy, Green sensors, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, Sustain

PicoJetter – Dispenser

The Nordson EFD system is a multifunctional deposition tool for inks and paste over a wide viscosity range.

April 15, 2024

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, Sustain

PIXDRO/LP50 InkJetPrinter

The PiXDRO LP50 enables multi-material 2D and 3D inkjet printing.

April 15, 2024

Showroom HMU Metrology / Characterisation, Optical Component Neuromorphic computing, Energy autonomy, Power, Think

Time Resolved Photoluminescence (TRPL) (FS5)

Advanced spectroscopy techniques for precise molecular analysis, covering fluorescence, phosphorescence, near-infrared spectra, and polarization/anisotropy measurements.

April 15, 2024

Showroom HMU Metrology / Characterisation, Optical Component Neuromorphic computing, Energy autonomy, Power, Think

QE-R EnliTech

Quantum Efficiency/ IPCE Measurement System

April 15, 2024

Showroom HMU Mechanical, Metrology / Characterisation Component Neuromorphic computing, Energy autonomy, Power, Think

Park XE7 AFM platform

Atomic Force Microscopy (AFM) platform including Scanning Kelvin Probe Microscopy (SKPM), Dynamic Contact EFM (DC-EFM) and Piezoresponse Force Microscopy (PFM) modes

April 15, 2024

Showroom HMU Electrical, Metrology / Characterisation Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Open Air Facility

Outdoor PV monitoring

April 15, 2024

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Modix 60

Large size parts manufacturing with the material extrusion 3D printing method.

April 15, 2024

Showroom HMU Metal deposition, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

MBraun Glove Box

S2S pilot line

April 15, 2024

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Printing, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Intamsys Funmat HT

Parts manufactured with the material extrusion 3D printing method from various polymeric materials from common to high-performance ones.

April 15, 2024

Showroom HMU Electrical, Metrology / Characterisation Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

InfinityPV vLBIC

Light Beam Induced Current (LBIC) system

April 15, 2024

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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