Optical lithography Archives - Page 4 of 5

Modix 60

Large size parts manufacturing with the material extrusion 3D printing method....

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HMU

Intamsys Funmat HT

Parts manufactured with the material extrusion 3D printing method from various polymeric materi...

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HMU

Formlabs 3B+

Parts manufactured with the vat photopolymerization 3D printing method from various polymeric r...

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HMU

High temperature processes

Showroom WUT CEZAMAT Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Energy autonomy, Photonic sensing, Power, Sense

High-temperature processes (boron diffusion, oxidation, LPCVD, and thermal annealing) in furnac...

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WUT CEZAMAT

Photolithography

Showroom WUT CEZAMAT Optical lithography, Processing/Fabrication Energy autonomy, Photonic sensing, Power, Sense

UV photolithography process with um resolution for patterning the predefined shapes in a photor...

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WUT CEZAMAT

Micro/Nano electrodes for electrochemistry

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Sense

On chip micro/nanoelectrodes fabricated at Tyndall can be tailored and/or modified for electroc...

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Tyndall

High resolution 3D-printer

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

High resolution 3D-printer for prototyping of fluidic cell or other mechanical parts....

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Tyndall

Piezoelectric Al1-xScxN thin-film stack

Showroom Tyndall Dielectric deposition, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

Tyndall National Institute offers Piezoelectric Al1-xScxN thin-film with Sc concentration of 6%...

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Tyndall

Advanced PiezoMEMS device design and fabrication

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...

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Tyndall

Transfer printing for heterogeneous integration

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Suitably prepared photonic or electronic components can be heterogeneously integrated by transf...

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Tyndall

Modix 60

Intamsys Funmat HT

Formlabs 3B+

High temperature processes

Photolithography

Micro/Nano electrodes for electrochemistry

High resolution 3D-printer

Piezoelectric Al1-xScxN thin-film stack

Advanced PiezoMEMS device design and fabrication

Transfer printing for heterogeneous integration

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