CONNECT - INFRACHIP

TECHNOLOGIES

Access what you need to build energy-efficient radio and optical communications for autonomous hybrid systems for the secure edge. The technology blocks on offer range from characterisation installations to complete set of process tools and libraries for the fabrication of microwave and photonic devices to novel platform technologies based on materials such as graphene and polymers.

CONNECT

RF Components

This technology pillar will have offerings from Chalmers, AMO, Tyndall and CNRS. The offering will include the microwave and photonic processing line consisting of a complete set of process tools for the fabrication of microwave and photonic devices and components. It will have on offer MMIC process which can be used to realize graphene-based circuits for RF communications, for example at WiFi frequency. AlN and AlScN semicondutor wafer processing for RF front applications will be available on this technology Platform. Energy harvesting in the field of electromagnetic energy harvesting, mixed signal design, characterization of RF components, antennas and innovative substrates will be on offer.

RF Front end design

AMO and Tyndall will provide their capabilties under this technology pillar. The offerings will have the MMIC process which can be used to realize graphene-based circuits for RF communications, for example at WiFi frequency. The offering will also have the Surface Acoustic Wave resonator development platform for RF front end application.

Short range optical communications

JOR will offer their optical communications technology under this section. They have set up a platform to offer (Freeform) Micro-optical components, Photonic structures (e.g. Plasmonic, metalenses) , Waveguides, resonators and Optical design.

Test & Characterization Platform

Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Modelling / Database, Optical, Physical/Structural Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain

Test and Characterisation Platform - Electrical, optical and physical characterization of mater...

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CNRS-FMNT

Cleanroom Characterization

Showroom Chalmers University Electrical, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers a range of characterization tools for fabricated devices. Scanning electr...

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Chalmers University

Automatized characterization

Showroom Chalmers University Metrology / Characterisation, Optical, Physical/Structural Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers optical and electron microscopy tools for automatized morphological chara...

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Chalmers University

Advanced Dry Etching Platform

Showroom Chalmers University Dry etching, Plasma etching, Processing/Fabrication, Wet etching Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers several tools and ready-to-use recipes for etching of diverse materials a...

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Chalmers University

Wet Chemistry

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Wet bench for imprint processes: Arias Lithography wet bench: Arias Standard cleaning: Arias ...

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AMO GmbH

Dry Etching

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Inductively Coupled Plasma Reactive Ion Etcher(ICP-RIE): Oxford Instruments PlasmaLab System 10...

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AMO GmbH

Deposition

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Sputtering system: Creavac Creamet500s E-beam evaporator: FHR Star 200 EVA, Plasma-enhance...

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AMO GmbH

Advanced Lithography Tool

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Electron Beam Lithography(EBL): Raith EBPG 5200 Photolithography(PL): Semi-Automatic Mask Ali...

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AMO GmbH

Characterization

Showroom AMO GmbH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m². High-end production f...

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AMO GmbH

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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