CONNECT - INFRACHIP

TECHNOLOGIES

Access what you need to build energy-efficient radio and optical communications for autonomous hybrid systems for the secure edge. The technology blocks on offer range from characterisation installations to complete set of process tools and libraries for the fabrication of microwave and photonic devices to novel platform technologies based on materials such as graphene and polymers.

CONNECT

RF Components

This technology pillar will have offerings from Chalmers, AMO, Tyndall and CNRS. The offering will include the microwave and photonic processing line consisting of a complete set of process tools for the fabrication of microwave and photonic devices and components. It will have on offer MMIC process which can be used to realize graphene-based circuits for RF communications, for example at WiFi frequency. AlN and AlScN semicondutor wafer processing for RF front applications will be available on this technology Platform. Energy harvesting in the field of electromagnetic energy harvesting, mixed signal design, characterization of RF components, antennas and innovative substrates will be on offer.

RF Front end design

AMO and Tyndall will provide their capabilties under this technology pillar. The offerings will have the MMIC process which can be used to realize graphene-based circuits for RF communications, for example at WiFi frequency. The offering will also have the Surface Acoustic Wave resonator development platform for RF front end application.

Short range optical communications

JOR will offer their optical communications technology under this section. They have set up a platform to offer (Freeform) Micro-optical components, Photonic structures (e.g. Plasmonic, metalenses) , Waveguides, resonators and Optical design.

Advanced PiezoMEMS device design and fabrication

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...

Access Provider / Facilities

Tyndall

Transfer printing for heterogeneous integration

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Suitably prepared photonic or electronic components can be heterogeneously integrated by transf...

Access Provider / Facilities

Tyndall

Integrated-Magnetics Design and Development

Showroom Tyndall Electrical, Magnetic, Metrology / Characterisation, Physical/Structural Connect, Hybrid SiP/SoC, PMU design, Power, Power electronics, RF components, Sustain

Integrated-Magnetics Design and Development includes high-frequency magnetics-on-silicon design...

Access Provider / Facilities

Tyndall

Magnetic Material Characterisation

Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Metrology / Characterisation, Optical Advanced sensing, Connect, Green sensors, Quantum and spin devices engineering, RF components, Sense, Sustain, Think

Magnetic Material Characterisation - SPINCarac offers a suit of equipment dedicated to characte...

Access Provider / Facilities

CNRS-FMNT

FIB-STEM

Showroom CNRS-FMNT Metrology / Characterisation, Physical/Structural Component Neuromorphic computing, Connect, Energy autonomy, Hybrid SiP/SoC, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Short-range optical communications, Sustain, Think

This tool consists of a scanning electronic microscope SEM equipped with a focalized ion beam F...

Access Provider / Facilities

CNRS-FMNT

Physico-chemical Characterisation

Showroom CNRS-FMNT Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain

The Physico-chemical Characterisation - IMPACT platform integrates several physico-chemical ch...

Access Provider / Facilities

CNRS-FMNT

Terahertz characterisation

Showroom CNRS-FMNT Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Terahertz characterisation - PLATERA platform: Terahertz (50 GHz – 4 THz) characterization an...

Access Provider / Facilities

CNRS-FMNT

Hyperfrequency Characterisation Platform

Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Connect, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, RF components, RF front-end design, Sustain

This platform is dedicated to the analysis and characterization, on a wide band of frequency, o...

Access Provider / Facilities

CNRS-FMNT

EMFI: Electro-Magnetic Fault Injection

Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Metrology / Characterisation, Others Connect, Green electronics and substrates, Green sensors, RF components, Sustain

A test bench dedicated to security characterization through electromagnetic fault injection on ...

Access Provider / Facilities

CNRS-FMNT

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

Privacy Policy Legal Notice