SENSE - INFRACHIP

TECHNOLOGIES

Access to three technology blocks for advanced sensing based on state-of-the-art platform technologies such as electrochemical sensors, sustainable and flexible sensors for hybrid integration into conformable and/or biodegradable/recyclable/biobased substrates, and novel integrated photonic sensors

SENSE

Advanced Sensing Technologies

Under this technology pillar Tyndall, NCSRD, JOR, AMO and CNRS offer their platforms. The offering are for the development of sensors in various domains like magnetic, optical, electronic, chemical, biological, mechanical with various materials. The offerings range from design, simulation, fabrication to testing of the sensors.

Stretchable and flexible sensors

JOR and UNOVA offer their sensor integration platform under this technology pillar. The development of the sensing platform on this offering is on semiconductor and flexible substrates.

Photonic Sensing

WUT/ CEZAMAT, AMO and NCSRD offer their technology on sensor development. They offer optical-based sensors technology. They offer the development of photonic integrated circuits (PICs) operating in visible and mid-IR bands. The offering also have measurement set up like on-chip spectroscopy using gratings, filters, ring resonators, Mach Zehnder interferometers, arrayed waveguide gratings etc. The application of this technology platforms range from bio-diagnostics, food safety, environmental monitoring, forensics etc.

Photonic Integrated Circuits

Showroom WUT CEZAMAT Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Photonic sensing, Sense

Silicon nitride passive photonic integrated circuits operating in VIS and C-band for user-defin...

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WUT CEZAMAT

R2R UV-Nanoimprinting

Showroom JOANNEUM RESEARCH Devices / Test structures, Printing, Processing/Fabrication Advanced sensing, Connect, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain

Our roll-to-roll nanoimprinting machine facilitates continuous and therefore cost-effective pro...

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JOANNEUM RESEARCH

XPS and Surface Analysis

Showroom INL Metrology / Characterisation, Physical/Structural Advanced sensing, Sense, Stretchable and flexible sensors

A vacuum system that combines surface analysis methods for characterization of thin solid films...

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INL

Thermal processing

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Dry oxidation furnace: Centrotherm Wet Oxidation furnace: Centrotherm Low Pressure Chemical V...

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AMO GmbH

Battery Energy Storage

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, Sustain

Simulation and processing of battery energy storage materials and architectures for integration...

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Tyndall

Collaborative Robots, Virtual Reality and Haptic Devices

Showroom Tyndall Devices / Test structures, Others Advanced sensing, Sense

Tyndall’s Collaborative Robotics Lab is equipped with cutting-edge technology, including the ...

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Tyndall

Photolithography

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Photolithography commonly refers to the pattern transfer of a photomask to a light-sensitive ma...

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NCSR Demokritos

Rapid Thermal Processing

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Rapid Thermal Processing (RTP) is a heat treatment where semiconductor substrates or other mate...

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NCSR Demokritos

Metal Evaporators

Showroom NCSR Demokritos Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Metal evaporation is a versatile high-vacuum physical vapour deposition technique for producing...

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NCSR Demokritos

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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