Metal deposition Archives - Page 6 of 6

Transfer printing for heterogeneous integration

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Suitably prepared photonic or electronic components can be heterogeneously integrated by transf...

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Tyndall

Deposition Processes

Showroom INL Dielectric deposition, Metal deposition, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Energy autonomy, Photonic sensing, Power, Quantum and spin devices engineering, Sense, Stretchable and flexible sensors, Think

The INL Cleanroom offers a comprehensive set of equipment for thin-film deposition by PVD and C...

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INL

Molecular Beam Epitaxy (MBE) for spintronics

Showroom CNRS-FMNT Dielectric deposition, Metal deposition, Metrology / Characterisation, Others, Physical/Structural, Plasma etching, Processing/Fabrication Advanced sensing, Green electronics and substrates, Quantum and spin devices engineering, Sense, Sustain, Think

Molecular Beam Epitaxy (MBE) for spintronics - the SPIN2D platform consists in a cluster of Mol...

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CNRS-FMNT

Physico-chemical Characterisation

Showroom CNRS-FMNT Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain

The Physico-chemical Characterisation - IMPACT platform integrates several physico-chemical ch...

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CNRS-FMNT

Quantum superconducting circuits

Showroom Chalmers University Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication Component Neuromorphic computing, Quantum and spin devices engineering, Think

We offer a complete processing platform for fabrication of both low-Tc and high-Tc superconduct...

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Chalmers University

Wet Chemistry

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Wet bench for imprint processes: Arias Lithography wet bench: Arias Standard cleaning: Arias ...

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AMO GmbH

Dry Etching

Inductively Coupled Plasma Reactive Ion Etcher(ICP-RIE): Oxford Instruments PlasmaLab System 10...

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AMO GmbH

Deposition

Sputtering system: Creavac Creamet500s E-beam evaporator: FHR Star 200 EVA, Plasma-enhance...

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AMO GmbH

Advanced Lithography Tool

Electron Beam Lithography(EBL): Raith EBPG 5200 Photolithography(PL): Semi-Automatic Mask Ali...

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AMO GmbH

Characterization

Showroom AMO GmbH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m². High-end production f...

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AMO GmbH

Transfer printing for heterogeneous integration

Deposition Processes

Molecular Beam Epitaxy (MBE) for spintronics

Physico-chemical Characterisation

Quantum superconducting circuits

Wet Chemistry

Dry Etching

Deposition

Advanced Lithography Tool

Characterization

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