Connect – Page 5 – INFRACHIP

Multi-material 3D Printed Electronics

Showroom Tyndall Devices / Test structures, Metal deposition, Processing/Fabrication Connect, Green electronics and substrates, RF components, RF front-end design, Sustain

The 3D printed RF electronics facility at Tyndall offers is equipped with two distinct multi-ma...

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Atomic Force Microscope

Showroom Tyndall Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Bruker Atomic Force Microscope (AFM) – Dimension Icon...

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Tyndall

Flexifab Nanofabrication Cleanroom

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Access to Tyndall FlexiFab Clean Room for non-standard processing...

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HyperPath

Showroom Tyndall Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Connect, RF components, RF front-end design, Short-range optical communications

HyperPath is a software solution for enabling secure and reliable wireless connectivity for cha...

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Tyndall

400 GHz Vector Network Analyser (VNA) and antenna chamber

Showroom Tyndall Devices / Test structures Connect, RF components, RF front-end design, Short-range optical communications

Vector Network Analyser capable of performing measurements up to 400 GHz. The VNA is natively c...

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Tyndall

Electronic Component Packaging

Showroom Tyndall Advanced sensing, Connect, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, Sense, Stretchable and flexible sensors, Sustain

The Tyndall Packaging Laboratory offers a comprehensive range of component assembly capabilitie...

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Tyndall

Equipment offering: Piezoelectric coefficient d33 measurement

Showroom Tyndall Dielectric deposition, Electrical, Metal deposition, Metrology / Characterisation, Processing/Fabrication Advanced sensing, Connect, Energy autonomy, Power, RF components, RF front-end design, Sense

d33 indicates charge per unit force in the polarisation direction a piezoelectric sample. In Ty...

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Tyndall

Piezoelectric Al1-xScxN thin-film stack

Showroom Tyndall Dielectric deposition, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Processing/Fabrication Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

Tyndall National Institute offers Piezoelectric Al1-xScxN thin-film with Sc concentration of 6%...

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Tyndall

Advanced PiezoMEMS device design and fabrication

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, Think

At Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...

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Tyndall

Transfer printing for heterogeneous integration

Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Suitably prepared photonic or electronic components can be heterogeneously integrated by transf...

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Tyndall

Multi-material 3D Printed Electronics

Atomic Force Microscope

Flexifab Nanofabrication Cleanroom

HyperPath

400 GHz Vector Network Analyser (VNA) and antenna chamber

Electronic Component Packaging

Equipment offering: Piezoelectric coefficient d33 measurement

Piezoelectric Al1-xScxN thin-film stack

Advanced PiezoMEMS device design and fabrication

Transfer printing for heterogeneous integration

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