Hybrid SiP/SoC Archives - Page 2 of 4

Direct laser writing (DLW) facilities

Direct laser writing is a fabrication technique that uses a focused laser beam to create precis...

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Tyndall

Time domain diffuse optical spectrometer (450-1700 nm)

Showroom Tyndall Metrology / Characterisation, Optical, Others, Physical/Structural Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Time domain diffuse optical spectrometer will characterize accurately the absorption and reduce...

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Tyndall

Biophotonics probes and sensors integration (BioProbe)

Showroom Tyndall Devices / Test structures, Modelling / Database, Others Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

BioProbe is a collaborative initiative by the biophotonics team at Tyndall, focusing on the des...

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Tyndall

X-ray and ultraviolet photoelectron spectroscopy (XPS/UPS)

Showroom UNINOVA Electrical, Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Quantum and spin devices engineering, Sense, Stretchable and flexible sensors, Sustain, Think

UNINOVA offers characterization of surfaces in terms of chemical (oxidation states) and element...

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UNINOVA

Atomic Force Microscope

Showroom Tyndall Metrology / Characterisation, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Bruker Atomic Force Microscope (AFM) – Dimension Icon...

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Tyndall

Flexifab Nanofabrication Cleanroom

Showroom Tyndall Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Non-volatile memories, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Access to Tyndall FlexiFab Clean Room for non-standard processing...

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Tyndall

High-power probe station

Showroom Tyndall Electrical, Metrology / Characterisation Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, PMU design, Power, Power electronics, Sustain

MPI High Power Semi-Automatic Probe Station (Model MPI TS3000 HP)...

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Tyndall

Hybrid Chip-Integration Laboratory

Showroom WUT CEZAMAT Electrical, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Hybrid SiP/SoC, Sustain

In this laboratory we offer electronic assembly with the use of our Finetech Flip-Chip Pico dev...

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WUT CEZAMAT

3D – confocal laser microscope

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

The 3D laser scanning microscope of the VK-X1050 model series uses two different measurement pr...

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JOANNEUM RESEARCH

Electronic Component Packaging

Showroom Tyndall Advanced sensing, Connect, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, Sense, Stretchable and flexible sensors, Sustain

The Tyndall Packaging Laboratory offers a comprehensive range of component assembly capabilitie...

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Tyndall

Direct laser writing (DLW) facilities

Time domain diffuse optical spectrometer (450-1700 nm)

Biophotonics probes and sensors integration (BioProbe)

X-ray and ultraviolet photoelectron spectroscopy (XPS/UPS)

Atomic Force Microscope

Flexifab Nanofabrication Cleanroom

High-power probe station

Hybrid Chip-Integration Laboratory

3D – confocal laser microscope

Electronic Component Packaging

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