SUSTAIN - INFRACHIP

TECHNOLOGIES

Here are listed all the required processing steps and technologies for developing sustainable low-power electronics with low manufacturing cost and low environmental impact during manufacturing.

SUSTAIN

Green Electronics & Substrates

UNOVA, HMU and JOR will have their technology offerings under this platform. This technology pillar offers users economically and environmentally sustainable routes to prepare substrates, inks, films and devices, that can be used as standalone projects or as components for the integration of systems. The platform also offers characterization facilities. The offering will be on semiconductor and flexible substrates.

Green Sensors

Tyndall and WUT/ CEZAMAT will have their offerings under this platform. Under this platform there will be offerings to develop LIG sensors both of flexible and wafer substrates. It will have on offering development of electronic structures such as luminescent displays, textronic materials and graphene electrodes on flexible and stretchable substrates such as polymer film, common fabrics and paper.

Hybrid SiP/SoC

WUT/CEZAMT and Tyndall will offer their Hybrid and heterogeneous integration capabilities under this technology pillar. The offering will have the capability to perform the assembly using a Finetech Flip-Chip Pico device or a small, self-built heating press, allowing for multiple connections to be made at the same time. The platform will offer the Micro Transfer Printing technology for packaging.

Plasma – enhanced Chemical Vapor Deposition (PECVD)

Showroom HMU Plasma etching, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

The above-mentioned technique is crucial for fabricating and characterizing materials like grap...

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HMU

Hot roll mill

Showroom HMU Devices / Test structures, Dielectric deposition, Metal deposition, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Mixing hot roll milling machine - it can produce thermoplastic materials master batches up to 0...

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HMU

Custom glassware facility

Showroom HMU Dielectric deposition, Dry etching, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Others, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Custom borosilicate glassware production facility (pieces up to 30cm length)....

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HMU

Electrospinning system

Showroom HMU Dielectric deposition, Dry etching, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Nano Fiberlabs E05 electrospinning equipment ...

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HMU

High pressure synthesis

Showroom HMU Dielectric deposition, Dry etching, Metal deposition, Metrology / Characterisation, Optical, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

High pressure nanomaterials synthesis - up to gram scale/batch – in Stainless Steel autoclave...

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HMU

Electronic Component Packaging

Showroom Tyndall Advanced sensing, Connect, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, Sense, Stretchable and flexible sensors, Sustain

The Tyndall Packaging Laboratory offers a comprehensive range of component assembly capabilitie...

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Tyndall

Aerosol-Jet 300 Optomec

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Energy autonomy, Green sensors, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, Sustain

The Aerosol Jet technology enables printing of functional inks on both 2D and 3D substrates....

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JOANNEUM RESEARCH

Die Bonder

Showroom JOANNEUM RESEARCH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, Sustain

Tresky T3000 Pro die bonder to enable SMT assembly...

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JOANNEUM RESEARCH

PicoJetter – Dispenser

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Energy autonomy, Green sensors, PMU design, Power, Power electronics, Sense, Stretchable and flexible sensors, Sustain

The Nordson EFD system is a multifunctional deposition tool for inks and paste over a wide visc...

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JOANNEUM RESEARCH

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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