SUSTAIN - INFRACHIP

TECHNOLOGIES

Here are listed all the required processing steps and technologies for developing sustainable low-power electronics with low manufacturing cost and low environmental impact during manufacturing.

SUSTAIN

Green Electronics & Substrates

UNOVA, HMU and JOR will have their technology offerings under this platform. This technology pillar offers users economically and environmentally sustainable routes to prepare substrates, inks, films and devices, that can be used as standalone projects or as components for the integration of systems. The platform also offers characterization facilities. The offering will be on semiconductor and flexible substrates.

Green Sensors

Tyndall and WUT/ CEZAMAT will have their offerings under this platform. Under this platform there will be offerings to develop LIG sensors both of flexible and wafer substrates. It will have on offering development of electronic structures such as luminescent displays, textronic materials and graphene electrodes on flexible and stretchable substrates such as polymer film, common fabrics and paper.

Hybrid SiP/SoC

WUT/CEZAMT and Tyndall will offer their Hybrid and heterogeneous integration capabilities under this technology pillar. The offering will have the capability to perform the assembly using a Finetech Flip-Chip Pico device or a small, self-built heating press, allowing for multiple connections to be made at the same time. The platform will offer the Micro Transfer Printing technology for packaging.

Ellipsometer VASE

Showroom JOANNEUM RESEARCH Metrology / Characterisation, Optical, Physical/Structural Green electronics and substrates, Green sensors, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Variable Angle Spectroscopic Ellipsometer from J.A.Woollam Inc. for research on all types of ma...

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JOANNEUM RESEARCH

3D – confocal laser microscope

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

The 3D laser scanning microscope of the VK-X1050 model series uses two different measurement pr...

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JOANNEUM RESEARCH

Jupiter AFM

Showroom JOANNEUM RESEARCH Electrical, Magnetic, Mechanical, Metrology / Characterisation, Physical/Structural Green electronics and substrates, Green sensors, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Oxford instruments/Jupiter XR - Atomic Force Microscope is a large-sample machine that offers h...

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JOANNEUM RESEARCH

Screen Printer Thieme

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, Sustain

Screen Printer LAB1000 for printing rigid and flexible materials....

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JOANNEUM RESEARCH

Planetary Ball Milliing PM100

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

The Planetary ball mill PM100 (Canada) is a compact, lubrication-free laboratory system designe...

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HMU

Environmentally friendly inks

Showroom UNINOVA Metrology / Characterisation, Optical, Physical/Structural, Printing Green electronics and substrates, Green sensors, Sustain

UNINOVA offers the access to the entire value chain related to the production and characterizat...

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UNINOVA

Printed thin films and devices

Showroom UNINOVA Devices / Test structures, Electrical, Mechanical, Metrology / Characterisation, Optical, Physical/Structural, Printing Component Neuromorphic computing, Green electronics and substrates, Green sensors, Sense, Stretchable and flexible sensors, Sustain, Think

UNINOVA offers the access to the entire value chain related to the production and characterizat...

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UNINOVA

Spray system

Showroom HMU Devices / Test structures, Metal deposition, Processing/Fabrication Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Custom made Spray (pyrolysis) System, with multiple nozzles. Suitable for metal oxide depositio...

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HMU

Milling and size separation

Showroom HMU Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Power, Sustain, Think

Powders processing by milling and dimensional separation....

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HMU

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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