devinf20, Author at INFRACHIP

Advanced Dry Etching Platform

Myfab Chalmers offers several tools and ready-to-use recipes for etching of diverse materials and applications.

April 11, 2024

Showroom Chalmers University Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Cleanroom Broad Fabrication Platform

Myfab Chalmers offers a range of cleanrooms processes for full micro/nanofabrication. Deposition, etching, and lithography tools are available for a large range of materials and can be adapted for specific applications.

April 11, 2024

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Wet Chemistry

Wet bench for imprint processes: Arias
Lithography wet bench: Arias
Standard cleaning: Arias

April 10, 2024

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Thermal processing

Dry oxidation furnace: Centrotherm
Wet Oxidation furnace: Centrotherm
Low Pressure Chemical Vapour Deposition Furnace (LPCVD): Centrotherm
Rapid Thermal Annealing Tool: Jipelec

April 10, 2024

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Dry Etching

Inductively Coupled Plasma Reactive Ion Etcher(ICP-RIE): Oxford Instruments PlasmaLab System 100
Microwave Plasma Etcher: Tepla – Semi 300

April 10, 2024

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Deposition

Sputtering system: Creavac Creamet500s
E-beam evaporator: FHR Star 200 EVA,
Plasma-enhanced chemical vapor deposition (PECVD): Oxford Instruments
Atomic Layer Depostion (ALD): Oxford Instruments FlexAL, AtomFab

April 10, 2024

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Advanced Lithography Tool

Electron Beam Lithography(EBL): Raith EBPG 5200
Photolithography(PL): Semi-Automatic Mask Aligner EVG-420, Canon i-Line Stepper FPA3000 i5+,
Automatic Resist Coater and Developer EVG-150 & -SÜSS Microtec RCD8
Nano Imprint Lithography(NIL):, SÜSS MicroTec SCIL UV System MA8

April 10, 2024

Showroom AMO GmbH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

Characterization

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m². High-end production facilities for semiconductor technology are operated here in a highly flexible manner to enable high-quality nanofabrication together with material and device characterisation for rapid process changes and unconventional solutions. All of the equipment described below is available to customers and partners as part of our services.

March 27, 2024

Press Release and Newsletter

INFRACHIP Initial Press Release

March 14, 2024

Flyers

INFRACHIP flyer

(clic to open the 2 pages pdf)

February 20, 2024

About devinf20

Entries by devinf20

Advanced Dry Etching Platform

Cleanroom Broad Fabrication Platform

Wet Chemistry

Thermal processing

Dry Etching

Deposition

Advanced Lithography Tool

Characterization

INFRACHIP flyer

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