RF components Archives - Page 4 of 4 - INFRACHIP

Cleanroom Characterization

Showroom Chalmers University Electrical, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers a range of characterization tools for fabricated devices. Scanning electr...

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Chalmers University

Automatized characterization

Showroom Chalmers University Metrology / Characterisation, Optical, Physical/Structural Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers optical and electron microscopy tools for automatized morphological chara...

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Chalmers University

Advanced Dry Etching Platform

Showroom Chalmers University Dry etching, Plasma etching, Processing/Fabrication, Wet etching Connect, Power, Power electronics, Quantum and spin devices engineering, RF components, Think

Myfab Chalmers offers several tools and ready-to-use recipes for etching of diverse materials a...

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Chalmers University

Wet Chemistry

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Wet bench for imprint processes: Arias Lithography wet bench: Arias Standard cleaning: Arias ...

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AMO GmbH

Dry Etching

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Inductively Coupled Plasma Reactive Ion Etcher(ICP-RIE): Oxford Instruments PlasmaLab System 10...

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AMO GmbH

Deposition

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Sputtering system: Creavac Creamet500s E-beam evaporator: FHR Star 200 EVA, Plasma-enhance...

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AMO GmbH

Advanced Lithography Tool

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think

Electron Beam Lithography(EBL): Raith EBPG 5200 Photolithography(PL): Semi-Automatic Mask Ali...

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AMO GmbH

Characterization

Showroom AMO GmbH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think

AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m². High-end production f...

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AMO GmbH

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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