INFRACHIP provides:

• A network of approx. 8,000m2 of fully equipped cleanrooms for sensors (nanoelectrochemical, chemical, microfluidics, photonics based sensors, advanced biosensors, graphene enabled),
• manufacturing line for advanced spintronics; Large scale production of organic layers (R2R pilot lines, gravure, slot die, screen printing, etc.);
• R2R UV nanoimpriting lithography;
• Laser and plasma assisted vacuum deposition techniques;
• A wide range of sustainable circuits developed on paper or other recyclable substrates including sensors, TFTs, neuromorphics, energy harvesters and storage, antennas;
• Full set of tools for processing of devices at high frequencies based on various semiconductor technologies such as SiC, GaAs, InP and GaN;
• Miniature Wireless Sensor Network (WSN) optimized using a Multi-Paradigm Modelling (MPM) approach;
• Monolithic microwave integrated circuit (MMIC) processing based on graphene circuits for telecommunications; pilot line for RF front end components (like RF resonators, antennas, etc.);
• Facilities for the fabrication of flexible, polymer based optical components with free-of-form structure; large scale green inks/pastes production adaptable to various printing technologies;
• Advanced characterization tools for materials and layers properties evaluation under various conditions; micro-transfer printing for SoC and facilities for hybrid SiP integration.