![](https://infrachip.eu/wp-content/uploads/2024/04/Tyndall_15-495x400.jpg)
PMU design (Power Management Unit)
Showroom Tyndall Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Modelling / Database, Optical, Others, Physical/Structural Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, PMU design, Power, Power electronics, SustainDiscrete and Silicon power management circuit for energy harvesting and micro-power management....
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/Tyndall.png)
Tyndall
![](https://infrachip.eu/wp-content/uploads/2024/04/Tyndall_3-495x400.jpg)
Advanced PiezoMEMS device design and fabrication
Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Power, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain, ThinkAt Tyndall National Institute, we specialize in the forefront of PiezoMEMS technology, providin...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/Tyndall.png)
Tyndall
![](https://infrachip.eu/wp-content/uploads/2024/04/Tyndall_2.jpg)
Transfer printing for heterogeneous integration
Showroom Tyndall Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Hybrid SiP/SoC, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, ThinkSuitably prepared photonic or electronic components can be heterogeneously integrated by transf...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/Tyndall.png)
Tyndall
![](https://infrachip.eu/wp-content/uploads/2024/04/4-aICON-AFM-CNRS_FMNT_CEP_CROMA.jpg)
Test & Characterization Platform
Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Modelling / Database, Optical, Physical/Structural Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Stretchable and flexible sensors, SustainTest and Characterisation Platform - Electrical, optical and physical characterization of mater...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/04/Logo-CNRS-FMNT.png)
CNRS-FMNT
![](https://infrachip.eu/wp-content/uploads/2024/04/6Wet-495x400.jpg)
Wet Chemistry
Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, ThinkWet bench for imprint processes: Arias
Lithography wet bench: Arias
Standard cleaning: Arias
...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/AMO.png)
AMO GmbH
![](https://infrachip.eu/wp-content/uploads/2024/04/5_main-Collage-Tool-Operation-495x400.jpg)
Thermal processing
Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, ThinkDry oxidation furnace: Centrotherm
Wet Oxidation furnace: Centrotherm
Low Pressure Chemical V...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/AMO.png)
AMO GmbH
![](https://infrachip.eu/wp-content/uploads/2024/04/4Structure-transfer-using-RIE-495x400.jpg)
Dry Etching
Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, ThinkInductively Coupled Plasma Reactive Ion Etcher(ICP-RIE): Oxford Instruments PlasmaLab System 10...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/AMO.png)
AMO GmbH
![](https://infrachip.eu/wp-content/uploads/2024/04/3Atomic-Layer-deposition-495x400.jpg)
Deposition
Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, ThinkSputtering system: Creavac Creamet500s
E-beam evaporator: FHR Star 200 EVA,
Plasma-enhance...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/AMO.png)
AMO GmbH
![](https://infrachip.eu/wp-content/uploads/2024/04/1-Nano-Imprint-Lithography-s-495x400.jpg)
Advanced Lithography Tool
Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, ThinkElectron Beam Lithography(EBL): Raith EBPG 5200
Photolithography(PL): Semi-Automatic Mask Ali...
Access Provider / Facilities
![](https://infrachip.eu/wp-content/uploads/2024/02/AMO.png)
AMO GmbH