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You are here: Home1 / Sense2 / Advanced sensing

Molecular Beam Epitaxy (MBE) for spintronics

Showroom CNRS-FMNT Dielectric deposition, Metal deposition, Metrology / Characterisation, Others, Physical/Structural, Plasma etching, Processing/Fabrication Advanced sensing, Green electronics and substrates, Quantum and spin devices engineering, Sense, Sustain, Think
Molecular Beam Epitaxy (MBE) for spintronics - the SPIN2D platform consists in a cluster of Mol...
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CNRS-FMNT
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/Spintronics-CNRS.png 607 667 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 10:51:402025-02-20 15:03:21Molecular Beam Epitaxy (MBE) for spintronics

Physico-chemical Characterisation

Showroom CNRS-FMNT Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain
The Physico-chemical Characterisation - IMPACT platform integrates several physico-chemical ch...
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CNRS-FMNT
April 12, 2024
https://infrachip.eu/wp-content/uploads/2024/04/15-a-CNRS_FMNT_Showromm-IMPACT_LTM.jpg 488 440 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-12 09:17:262024-05-30 11:41:08Physico-chemical Characterisation

Terahertz characterisation

Showroom CNRS-FMNT Electrical, Magnetic, Mechanical, Metrology / Characterisation, Optical, Physical/Structural Advanced sensing, Component Neuromorphic computing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, PMU design, Power, Power electronics, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
Terahertz characterisation - PLATERA platform: Terahertz (50 GHz – 4 THz) characterization an...
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CNRS-FMNT
April 11, 2024
https://infrachip.eu/wp-content/uploads/2024/04/12-CNRS_FMNT-Platera_CROMA.jpg 535 936 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-11 14:40:012024-05-30 11:39:50Terahertz characterisation

Insulating Material Characterization

Showroom CNRS-FMNT Devices / Test structures, Electrical, Metrology / Characterisation Advanced sensing, Component Neuromorphic computing, Energy autonomy, Green electronics and substrates, Green sensors, Power, Sense, Stretchable and flexible sensors, Sustain, Think
This test bench is dedicated for characterizing the electrical properties of insulators within ...
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CNRS-FMNT
April 11, 2024
https://infrachip.eu/wp-content/uploads/2024/04/7-a-CNRS_FMNT_InsulatingMaterialsCharacterization_G2Elab.jpg 249 345 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-11 14:04:592024-04-16 08:06:41Insulating Material Characterization

Test & Characterization Platform

Showroom CNRS-FMNT Devices / Test structures, Electrical, Magnetic, Mechanical, Metrology / Characterisation, Modelling / Database, Optical, Physical/Structural Advanced sensing, Connect, Energy autonomy, Green electronics and substrates, Green sensors, Photonic sensing, Power, Power electronics, RF components, RF front-end design, Sense, Stretchable and flexible sensors, Sustain
Test and Characterisation Platform - Electrical, optical and physical characterization of mater...
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CNRS-FMNT
April 11, 2024
https://infrachip.eu/wp-content/uploads/2024/04/4-aICON-AFM-CNRS_FMNT_CEP_CROMA.jpg 225 225 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-11 13:17:342024-05-30 09:28:56Test & Characterization Platform

Wet Chemistry

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think
Wet bench for imprint processes: Arias Lithography wet bench: Arias Standard cleaning: Arias ...
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AMO GmbH
April 10, 2024
https://infrachip.eu/wp-content/uploads/2024/04/6Wet.jpg 654 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-10 13:47:362024-04-10 13:47:36Wet Chemistry

Dry Etching

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think
Inductively Coupled Plasma Reactive Ion Etcher(ICP-RIE): Oxford Instruments PlasmaLab System 10...
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AMO GmbH
April 10, 2024
https://infrachip.eu/wp-content/uploads/2024/04/4Structure-transfer-using-RIE.jpg 654 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-10 13:27:402024-04-10 13:27:56Dry Etching

Deposition

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think
Sputtering system: Creavac Creamet500s E-beam evaporator: FHR Star 200 EVA, Plasma-enhance...
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AMO GmbH
April 10, 2024
https://infrachip.eu/wp-content/uploads/2024/04/3Atomic-Layer-deposition.jpg 654 980 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-10 13:21:022024-04-10 13:21:02Deposition

Advanced Lithography Tool

Showroom AMO GmbH Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Magnetic, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Think
Electron Beam Lithography(EBL): Raith EBPG 5200 Photolithography(PL): Semi-Automatic Mask Ali...
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AMO GmbH
April 10, 2024
https://infrachip.eu/wp-content/uploads/2024/04/1-Nano-Imprint-Lithography-s.jpg 854 1280 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-04-10 13:06:462024-04-10 13:06:46Advanced Lithography Tool

Characterization

Showroom AMO GmbH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Connect, Photonic sensing, Power, Quantum and spin devices engineering, RF components, RF front-end design, Sense, Short-range optical communications, Stretchable and flexible sensors, Sustain, Think
AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m². High-end production f...
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AMO GmbH
March 27, 2024
https://infrachip.eu/wp-content/uploads/2024/03/2electrical-characterisation-s.jpg 854 1280 devinf20 https://infrachip.eu/wp-content/uploads/2024/01/infrachip-logo-3.png devinf202024-03-27 11:36:402024-05-24 16:17:41Characterization
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Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

Contact us

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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