SENSE - INFRACHIP

TECHNOLOGIES

Access to three technology blocks for advanced sensing based on state-of-the-art platform technologies such as electrochemical sensors, sustainable and flexible sensors for hybrid integration into conformable and/or biodegradable/recyclable/biobased substrates, and novel integrated photonic sensors

SENSE

Advanced Sensing Technologies

Under this technology pillar Tyndall, NCSRD, JOR, AMO and CNRS offer their platforms. The offering are for the development of sensors in various domains like magnetic, optical, electronic, chemical, biological, mechanical with various materials. The offerings range from design, simulation, fabrication to testing of the sensors.

Stretchable and flexible sensors

JOR and UNOVA offer their sensor integration platform under this technology pillar. The development of the sensing platform on this offering is on semiconductor and flexible substrates.

Photonic Sensing

WUT/ CEZAMAT, AMO and NCSRD offer their technology on sensor development. They offer optical-based sensors technology. They offer the development of photonic integrated circuits (PICs) operating in visible and mid-IR bands. The offering also have measurement set up like on-chip spectroscopy using gratings, filters, ring resonators, Mach Zehnder interferometers, arrayed waveguide gratings etc. The application of this technology platforms range from bio-diagnostics, food safety, environmental monitoring, forensics etc.

Fluorescence-Polarization Microscope

Showroom JOANNEUM RESEARCH Metrology / Characterisation, Optical, Physical/Structural Advanced sensing, Green electronics and substrates, Green sensors, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

A fluorescence microscope from Zeiss to characterize fluorescent markers is at hand as well as ...

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JOANNEUM RESEARCH

Ellipsometer VASE

Showroom JOANNEUM RESEARCH Metrology / Characterisation, Optical, Physical/Structural Green electronics and substrates, Green sensors, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Variable Angle Spectroscopic Ellipsometer from J.A.Woollam Inc. for research on all types of ma...

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JOANNEUM RESEARCH

3D – confocal laser microscope

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Green electronics and substrates, Green sensors, Hybrid SiP/SoC, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

The 3D laser scanning microscope of the VK-X1050 model series uses two different measurement pr...

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JOANNEUM RESEARCH

Jupiter AFM

Showroom JOANNEUM RESEARCH Electrical, Magnetic, Mechanical, Metrology / Characterisation, Physical/Structural Green electronics and substrates, Green sensors, Photonic sensing, Sense, Stretchable and flexible sensors, Sustain

Oxford instruments/Jupiter XR - Atomic Force Microscope is a large-sample machine that offers h...

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JOANNEUM RESEARCH

Screen Printer Thieme

Showroom JOANNEUM RESEARCH Dielectric deposition, Dry etching, e-beam lithography, Metal deposition, Optical lithography, Plasma etching, Printing, Processing/Fabrication, Wet etching Green sensors, Sense, Stretchable and flexible sensors, Sustain

Screen Printer LAB1000 for printing rigid and flexible materials....

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JOANNEUM RESEARCH

Oxide-based neuromorphic devices

Showroom UNINOVA Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Modelling / Database, Optical, Optical lithography, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Advanced sensing, Component Neuromorphic computing, Sense, Think

UNINOVA offers access to the entire value chain related to the design, simulation, fabrication,...

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UNINOVA

Thin-film circuits for sensors

Showroom UNINOVA Devices / Test structures, Dielectric deposition, Dry etching, e-beam lithography, Electrical, Mechanical, Metal deposition, Metrology / Characterisation, Optical, Optical lithography, Others, Physical/Structural, Plasma etching, Processing/Fabrication, Wet etching Sense, Stretchable and flexible sensors

UNINOVA offers the access to the entire value chain related to the design, simulation, fabricat...

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UNINOVA

Printed thin films and devices

Showroom UNINOVA Devices / Test structures, Electrical, Mechanical, Metrology / Characterisation, Optical, Physical/Structural, Printing Component Neuromorphic computing, Green electronics and substrates, Green sensors, Sense, Stretchable and flexible sensors, Sustain, Think

UNINOVA offers the access to the entire value chain related to the production and characterizat...

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UNINOVA

Electronic Component Packaging

Showroom Tyndall Advanced sensing, Connect, Green sensors, Hybrid SiP/SoC, Photonic sensing, Power, Power electronics, RF components, Sense, Stretchable and flexible sensors, Sustain

The Tyndall Packaging Laboratory offers a comprehensive range of component assembly capabilitie...

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Tyndall

Project details:

TITLE: European Research Infrastructure on Semiconductor Chips

START-END: January 2024 – December2027
EU CONTRIBUTION: 14 457 463 €
TOPIC: HORIZON-INFRA-2023-SERV-01

Contact:

Coordinator: Tyndall National Institute

INFRACHIP (2024-2027) has received funding from the European Union’s Horizon Europe research and innovation actions under GA No. 101131822

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